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features & benefits two independent active light measurement channels for proximity sensing and/or gesture recognition integrated dc light cancellation circuitry two logarithmic ambient light channels with two different sensitivities minimum amount of external components stand-by and sleep modes for low power consumption integrated led drivers integrated battery voltage monitor integrated led temperature sensing circuitry integrated 16bit adc for high resolution a2d conversion integrated temperature sensor integrated watchdog timer easy digital communication interface via spi high input capacitance tolerant input current terminals high safety design by several diagnostic and monitoring functions applications robust proximity sensing smart touch displays & panels simple gesture detection driver-passenger discrimination ambient light sensing & display dimming functional diagram ordering information product code temperature code package code option c ode mlx75031 r ( - 40c to 105c) lq (qfn24 4x4) b mlx75031 c (0c to 70c) lq (qfn24 4x4) b general description the mlx75031 optical gesture & proximity sensing ic actively controls up to 2 independent active light measurement channels. each channel consists out of one or multiple leds, of any type, combined with one or more photodiodes, of any type. additional ac tive light channels can be added through multiplexing. integrated dc light suppression makes the sensors highly tolerant to background light interference. primary function is complemented with two integrated ambient light channels. internal control logic, configurable user registers and spi communication enable intuitive & programmable operation. extra features include a watchdog timer, on-board temperature sensor and self-diagnostics a re built-in to facilitate robust product design. the digital output from the active light and ambien t light channels can be used for proximity and ambi ent light detection. gestures such as swipe, zoom, scro ll can be recognized by software algorithms that ca n run on the customers microcontroller. reliable com munication is assured via an spi interface.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 2 of 2 39010xxxxx table of contents features & benefits features & benefits features & benefits features & benefits................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ .................................... ........ .... 1 11 1 applications applications applications applications ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ............................................... ............... ............... ............... 1 11 1 functional diagram functional diagram functional diagram functional diagram ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ .................................... ........ .... 1 11 1 ordering information ordering information ordering information ordering information ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................. .. . 1 11 1 general description general description general description general description ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................... ...... ... 1 11 1 table of contents table of contents table of contents table of contents ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ....................................... ....... ....... ....... 2 22 2 1. functional block diagram 1. functional block diagram 1. functional block diagram 1. functional block diagram ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... .... ....................... ....................... ....................... 4 44 4 2. device overview 2. device overview 2. device overview 2. device overview ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ .................................... ........ .... 4 44 4 3. glossary of terms 3. glossary of terms 3. glossary of terms 3. glossary of terms............................... . ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................... ...... ... 5 55 5 4. absolute maximum ratings 4. absolute maximum ratings 4. absolute maximum ratings 4. absolute maximum ratings........................ ........ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... . .................... .................... .................... 6 66 6 5. pin definitions & descriptions 5. pin definitions & descriptions 5. pin definitions & descriptions 5. pin definitions & descriptions ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................ ................ ................ ................ 7 77 7 6. general electrical specifications 6. general electrical specifications 6. general electrical specifications 6. general electrical specifications ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ............................................. ............. ............. ............. 9 99 9 7. sensor interface specific specifications 7. sensor interface specific specifications 7. sensor interface specific specifications 7. sensor interface specific specifications........ ........................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................ 10 1010 10 8. detailed general description 8. detailed general description 8. detailed general description 8. detailed general description ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ............................................... ............... ............... ............... 15 1515 15 8.1 active light channels a & b ................................................... ................................................... ................................................ 15 8.1.1 transimpedance amplifier (tia) .................................................. .............................................. 15 8.1.2 active light channel dc light measurement ... ................................................... ................. 16 8.2 ambient light sensor .......................... ................................................... ...................................... 17 8.2.1 normal operation ............................ ................................................... ................................... 17 8.2.2 logarithmic transfer function ............... ................................................... ............................ 17 8.2.3 calibration & temperaure compensaion ........ ................................................... .................. 18 8.2.4 response time ............................... ................................................... ..................................... 19 8.2.5 diagnostics mode operation .................. ................................................... ........................... 20 8.3 temperature sensor ............................ ................................................... ..................................... 21 8.4 analog to digital conversion................... ................................................... .................................. 22 8.5 output stage .................................. ................................................... ............................................ 22 8.5.1 dac ......................................... ................................................... ............................................. 22 8.5.2 led driver .................................. ................................................... .......................................... 23 8.5.3 led forward voltage measurement.............. ................................................... .................... 23 8.5.4 battery supply voltage measurement & monitori ng ................................................ .......... 24 8.6 power-on reset ................................ ................................................... ......................................... 25 8.7 oscillator (rc) ............................... ................................................... ............................................. 25 8.8 adc mux ....................................... ................................................... ............................................ 25 8.9 vstab analog +bandgap ......................... ................................................... ................................... 26 8.10 digital control .............................. ................................................... ............................................ 26 8.11 spi .......................................... ................................................... ................................................... 26
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 3 of 3 39010xxxxx 8.11.1 general description of the spi interface ... ................................................... ...................... 26 8.11.2 operation modes ............................ ................................................... .................................. 29 8.11.3 detailed explanation of spi instruction word s ................................................. ................. 30 8.11.3.1 nop C idle command ....................... ................................................... ............................. 30 8.11.3.2 cr C chip reset command .................. ................................................... ......................... 30 8.11.3.3 rslp/cslp C request sleep/confirm sleep .. ................................................... ................ 30 8.11.3.4 rstby/cstby - request standby/confirm stan dby ............................................... ......... 31 8.11.3.5 nrm C normal running mode................. ................................................... ..................... 31 8.11.4 sm C start measurement ..................... ................................................... ............................ 32 8.11.5 ro C start read-out ........................ ................................................... ................................. 34 8.11.6 dm+ro - start measurement combined with read -out .............................................. .... 36 8.11.7 wr/rr - write/read register ................ ................................................... .......................... 37 8.11.8 sd C start diagnostics ..................... ................................................... .................................. 38 8.12 internal status flags ........................ ................................................... ........................................ 40 8.13 user registers overview ...................... ................................................... ................................... 42 8.13.0 setana register ............................ ................................................... ..................................... 43 8.13.1 setah register ............................. ................................................... ...................................... 44 8.13.2 setal register ............................. ................................................... ....................................... 44 8.13.3 setbh register ............................. ................................................... ...................................... 45 8.13.4 setbl register ............................. ................................................... ....................................... 45 8.13.5 settp register ............................. ................................................... ....................................... 46 8.13.6 err register ............................... ................................................... ......................................... 47 8.13.7 rst register ............................... ................................................... ......................................... 48 8.13.8 version register ........................... ................................................... ...................................... 48 8.10.9 reserved register .......................... ................................................... .................................... 49 8.10.10 gainbuf register .......................... ................................................... .................................... 49 8.13.11/12 calib1/calib2 register ................. ................................................... .............................. 50 8.13.13 enchan register ........................... ................................................... ................................... 54 8.13.14 tamb register ............................. ................................................... ..................................... 55 8.13.15 setpls register ........................... ................................................... ..................................... 55 8.14 window watchdog timer ........................ ................................................... ............................... 56 8.15 reset behaviour .............................. ................................................... ........................................ 58 8.16 supply voltage behaviour ..................... ................................................... .................................. 59 8.17 wake-up from sleep or standby ................ ................................................... ............................ 60 8.18 crc calculation .............................. ................................................... ......................................... 61 8.19 global timing diagrams ....................... ................................................... ................................... 62 9. application information 9. application information 9. application information 9. application information ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... .... ....................... ....................... ....................... 63 6363 63 9.1 application circuit ........................... ................................................... ........................................... 63 10. standard information regarding manufacturabilit y of melexis products with different 10. standard information regarding manufacturabilit y of melexis products with different 10. standard information regarding manufacturabilit y of melexis products with different 10. standard information regarding manufacturabilit y of melexis products with different soldering processes soldering processes soldering processes soldering processes ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... .......... ............................. ............................. ............................. 64 6464 64 11. general recommendations 11. general recommendations 11. general recommendations 11. general recommendations - -- - esd/emc precautions esd/emc precautions esd/emc precautions esd/emc precautions ................................ ................................ ................................ ................................................... ............. ................................ ................................ .......................................... .......... .......... .......... 65 6565 65 12. package information 12. package information 12. package information 12. package information ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ....... .......................... .......................... .......................... 66 6666 66 12.1 qfn 4x4 (24 pins): quad flat no-lead with expo sed pad ........................................... ............. 66 13. disclaimer 13. disclaimer 13. disclaimer 13. disclaimer ................................ ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ ................................................... ............. ................................ ................................ .......................................... .......... .......... .......... 67 6767 67
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 4 of 4 39010xxxxx 1. functional block diagram figure 1 : mlx75031 functional block diagram 2. device overview the mlx75031 optical gesture & proximity sensing ic independently controls up to 2 active light channe ls. both channels, a and b, have externally connected p hotodiodes. external leds can be driven up to 150 m a by the built-in led driver. this current drive cap ability can also be used to drive a low cost bipola r transistor to increase the peak led current. the chip synchron izes the pulsing of the leds and the exposure time of the active light channel photodiodes whereby ambien t light and reflected led light are detected separately. any spurious light source is subtracted from the active light signal. see section 8.1. the two logarithmic current sensing channels c and d can be used to measure ambient light over a very wide intensity range. see section 8.2 for more det ails. as auxiliary features, the sensor integrates a watc hdog timer, can measure its own temperature, the le d temperature, monitor voltage supply level and perfo rm self diagnostics. all of this information is available via the spi in terface. see section 8.14, 8.3, 8.5.3, 8.5.4 or 8.11.8 for d etailed information. the sensor features sleep and standby modes to save on current consumption. (section 8.11.2) the spi interface is used for data transfer and con trol of the ic. the timing characteristics are expl ained in section 8.11.1 and the interface commands and progr ammable options in section 8.11.3 & 8.13. the sensor is available in both consumer and automo tive temperature grades.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 5 of 5 39010xxxxx 3. glossary of terms cr chip reset crc cyclic redundancy check cs chip select cslp confirm sleep cstby confirm standby dac digital to analog converter dc direct current dr device ready emc electromagnetic compatibility gnda ground for analog blocks of mlx75031 gndd ground for digital blocks of mlx75031 ir infrared lpf low-pass filter lsb least significant bit miso master in slave out mosi master out slave in mr master reset msb most significant bit mux multiplexer nop no operation nrm normal running mode osc oscillator otr optical transfer ratio por power on reset rco rc - oscillator ro read - out rr read register rslp request sleep rstby request standby sclk spi shift clock sm start measurement snr signal - to - noise ratio spi serial peripheral interface tia transimpedance amplifier vcca supply voltage for the analog blocks vccd supply voltage for the digital blocks vsense voltage across the shunt resistor wdt watchdog timer wr write register uc microcontroller
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 6 of 6 39010xxxxx 4. absolute maximum ratings parameter symbol conditions min max units supply voltage range vccd, vcca -0.3 5.0 v battery supply voltage range vsup t<400ms, no functionality, only during load dump t<2min, functional, not guaranteed to be within specifications -0.3 -0.3 40 28 v v voltage range drive_leda and drive_ledb -0.3 5.5 v voltage range on all pins except vccd, vcca, vsup, drive_leda, drive_ledb -0.3 v(vccd)+0.3 v(vcca)+0.3 v terminal current iterminal iled per bondpad battery connection -20 -20 +20 +155 ma ma storage temperature tstg -40 +150 c junction temperature tj +150 c esd capability of any pin (human body model) esdhbm human body model, acc. to aec-q100-002 rev d -2 +2 kv esd capability of any pin (charge device model) esdcdm charge device model acc. to aec- q100-011 rev b -500 +500 v maximum latchCup free current at any pin ilatch jedec- standard eia / jesd78 -100 +100 ma table 1 : absolute maximum ratings note : exceeding the absolute maximum ratings may c ause permanent damage. exposure to absolute-maximum-rated conditions for e xtended periods may affect device reliability.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 7 of 7 39010xxxxx 5. pin definitions & descriptions pin name functional schematic type function 1 gndd ground ground 2 \mr digital open dactive light output master reset 3 sclk digital input with pull-up spi shift clock 4 miso digital push-pull output with tri-state spi data output 5 mosi digital input with pull-down spi data input 6 \cs digital input with pull-up chip select 7 dr digital push-pull output device ready 8 \sleepb digital push-pull output sleep detect 9 active light pda analog input ir photo diode a 10 active light pdb analog input ir photo diode b 11 ambient light pdc analog input ambient light photo diode c 12 ambient light pdd analog input ambient light photo diode d 13 n.c analog input test pin, connect to ground via a resistor pad ccd vccd pad vccd pad en vccd pad ccd pad vccd pad vccd pad vcca pad vcca pad vcca pad vcca pad vcca pad
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 8 of 8 39010xxxxx table 2 : pin definitions and descriptions note : pins of measurement channels that are not us ed, can be left unconnected. however, this can lead to an error indicated by the corresponding error flags in the error register. 14 gndamb analog i/o ground ambient light channels 15 gnda ground ground 16 vcca supply regulated power supply 17 aout analog i/o test pin, connect to vcca 18 cext analog input external blocking cap, connected to gnda 19 shuntrgnd analog input shunt resistor feedback to ground 20 shuntr analog input shunt resistor feedback 21 drive_ledb analog output ir led emitter b 22 drive_leda analog output ir led emitter a 23 vsup supply led driver supply 24 vccd supply regulated power supply vcca pad vcca pad vcca pad vcca pad vcca pad vcca pad vcca pad
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 9 of 9 39010xxxxx 6. general electrical specifications table 3 : electrical specifications parameter symbol test conditions min typ max units supply voltage range vdd vccd and vcca pin 3.135 3.3 3.465 v supply current (active mode) idd i(vccd)+i(vcca) without photodiode dc current 6 ma supply current (standby mode) idd_stby i(vccd)+i(vcca) 350 ua supply current (sleep mode) idd_slp i(vccd)+i(vcca) without spi communication 30 ua battery supply voltage range vsup vsup pin 6 18 v battery supply current (active mode) ivsup i(vsup) with active light pulses i(vsup) without active light pulses 0 0 155 0.1 ma ma battery supply current (standby mode) ivsup_stby i(vsup) 0 10 ua battery supply current (sleep mode) ivsup_slp i(vsup) 0 10 ua operation temperature ta -40 105 c
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 10 of 10 39010xxxxx 7. sensor interface specific specifications the following characteristics are valid over the fu ll temperature range of t a = -40c to +105c and a supply range of vsup = 6.18v and vccd = vcca = 3.135..3.46 5v unless otherwise noted. active light channels (photodiode a & b) parameter symbol test conditions min typ max units optical transfer ratio pd led i i otr = 30 12000 dc sunlight current in the photodiode i sun 0 900 a fast full scale transition at i sunmax t sunrise 3.5 ms min. relative active light modulation (referred to received ir signal) pd pd i i min_ ? - 20 s led pulse - pd pulsed current 20a, - 25c - dc sun constant - response per channel 2.5ms 1 5 (*) % dynamic range of active light events (referred to received ir signal) ?i activelight 80 % active light repetition time acive light measurement channel a, channel b t rep_activelight 2.5 2.5 ms ms led pulse duration range t 0 selectable via register 15-8% 30+8% s max. input capacitance pda & pdb c pda , c pdb 80 pf dc light measurement range i dc range 0 900 a dc light measurement offset i dc offset i dc = 0ua & vdd=3.3v 1360 1960 2460 lsb dc light measurement slope i dc sens 28 35 44 lsb/a dc light measurement inearity error i dc range: 0ua -> 900ua 5 8 % dc light measurement word length 16 bit dc light measurement noise for averaging of 8 measurements 3 bit error condition err_tia critical error detected on tia output, if tia outpu t outside 1.1v+/- (0.65 0.75v) table 4 : active light channels specification (*) the 5% is really worst case condition, i.e. wit h otr = 30 and rshunt = 1ohm, this condition is not realistic and should be avoid ed in a the application
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 11 of 11 39010xxxxx table 5 : ambient light channels specifications ambient light channels (photodiode c & d) parameter symbol test conditions min typ max units input current range for detector c iambc detector c 0.01 1040 ua input current threshold level iambc_detect detector c 333 na input capacity on ambient pdc cambc at 1v, detector c 1 nf input current range for detector d iambd detector d 0.002 20 ua input current threshold level iambd_detect detector d 22 na input capacity on ambient pdd cambd at 1v, detector d 100 pf transfer function logarithmic vamb see section 8.2.2 output ambient channel c at vdd=3.3v, iin=100ua 30464 32768 37376 lsb output ambient channel d at vdd=3.3v, iin=10ua 30464 32768 37376 lsb slope ambient channel c at vdd=3.3v and 105c 530 0 5900 6500 lsb/dec slope ambient channel d at vdd=3.3v and 105c 5300 5900 6500 lsb/dec ambient channels linearity error for iin iambx_detect 3 5 % ambient light word length 16 bits ambient light channel accuracy for averaging of 16 measurements 13 bits ambient light response time se e s ection 8.2.4 for a detailed explanation of this parameter. for iin iambx_detect 3 ms ambient light measurement repetition rate 10 ms error condition err_amb err_amb it is set if the output common mode of one ambient channel sc filter is out of range (meaning > 55% of vcca for each of the differential outputs).
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 12 of 12 39010xxxxx table 6 : temperature sensor specification (*) this value will be stored in the calib1 registe r. led driver parameter symbol test conditions min typ max units led pulse current shunt=1 1 150 ma shunt resistor values the minimum vsup voltage is affected by the drop across the shunt resistor 1 6.6 ohm shunt voltage 1 993 mv rising and falling time 1tau settling time, programmable via rise<1:0> 1..7 us dc offset level shunt bias voltage before transmitting the current pulse 1 mv time before pulse tdc_pulse biasing time of the led driver (shunt voltage = dc offset level) before pulse transmission. see section 8.13.0 for details. 200 us error condition err_drv err_drv difference between vdac and vsense. detecti on level larger 200mv table 7 : led driver specification die temperature sensor parameter symbol test conditions min typ max units temp. sensor range ? -40 105 c temp. sensor transfer function (*) v ? at vdd=3.3v -82 -67 -51 lsb/k temp. sensor output v@85c at vdd=3.3v and full calib 1/2 ranges 5990 8096 10203 lsb temp. sensor error ? error@30c at vdd=3.3v 3 c temp. response time tresp_ ? 1 s temp. sensor word length 16 bits temp. sensor noise for averaging of 16 measurements 3 bits
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 13 of 13 39010xxxxx table 8 : power on reset specification vsup voltage monitor parameter symbol test conditions min typ max units vsup measurement range 5 20 v vsup low threshold voltage vtsupl default vsuplow<1 :0> 6 v vsup low hysteresis vtsupl_hys 1 v vsup high threshold voltage vtsuph 20 v vsup high hysteresis vtsuph_hys 1.8 v gain error vtgain_err +/-2 % offset error vtoffset_err +/-50 lsb voltage monitor noise for averaging of 16 measurements 3 bits table 9 : vsup voltage monitor specification spi parameter symbol test conditions min typ max units spi word length 8 bit high-level input voltage vih 0.7vdd vdd v low-level input voltage vil 0 0.3vdd v hysteresis on digital inputs vhyst 0.28 v high o utput v oltage (not on pin mr) voh cl=30pf 0.8vdd vdd v low output v oltage (not on pin mr) vol cl=30pf 0 0.2vdd v input leakage ilk -10 10 a tri - state o utput leakage current ioz -10 10 a input capacitance, per pin cin 10 pf pull up resistance of sclk and \cs pin rpu pd - > leakage to vccd (causing a voltage drop across the pd resistor) 50k ohm por parameter symbol test conditions min typ max units por off threshold voltage vpor-on 1.8 2.85 v por on threshold voltage vpor-off 1.7 2.75 v por hysteresis voltage vhys 150 mv
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 14 of 14 39010xxxxx pull down resistance of mosi pin rpd pu - > leakage to gndd (causing a voltage drop across the pu resistor) 50k ohm output voltage low, pin mr voutl iodc = 2ma 0.1 v start-up time after power-on tstartup -8% 20 +8% ms start - up time after power - on only for spi tstartupspi 10 s start - up time after wake - up from sleep twakeup_slp -8% 20 +8% ms start - up time after wake - up from standby twakeup_st by -8% 20 +8% ms spi clock frequency fsclk = 1/tsclk 0.5 1 5 mhz frequency of internal rc oscillator frco = 1/trco -8% 2.5 +8% mhz cs low prior to first sclk edge tcs_sclk 50 ns cs high after last sclk edge tsclk_cs 50 ns cs high time between transmissions tcs_inter 50 ns time between cs high and dr low (*) tcs_dr 0 22.47 (239us) s wdt initial active window time twdt_init after por, watchdog reset and wake-up -8% 140 +8% ms wdt open window time twdt_open -8% 70 +8% ms wdt closed window time twdt_closed -8% 70 +8% ms mr low time during reset tmr after watchdog reset - 8% 2 +8% ms sleepb low after cs high tsleepb after csbty/cslp command 0 1.2 s error condition err_rco rco stuck at high or low error condition err_vref internal voltage regulator : err_vref is set if the regulator does not start (detection threshold in the range [1v;2v]) table 10 : spi specification (*) with random measurement start, the max time can be up to 239us, if an auto-zeroing phase of the ic is executed.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 15 of 15 39010xxxxx 8. detailed general description 8.1 8.18.1 8.1. .. . active light active light active light active light channels a channels a channels a channels a & & & & b bb b the mlx75031 has two separate active light channels . both channels work synchronously & independently. these channels are able to detect the amplitude/int ensity of a reflected signal whilst subtracting the dc variation of the background light or sunlight illum ination. the leds transmit one single light pulse (pulse dur ation is programmable via tp<2:0>) which is detecte d by the channel receiver. the pulse amplitude is sample d and amplified by a s&h stage synchronized with th e led pulse. in addition to the led pulse amplitude programming, the effective trans-impedance can be adjusted in order to maximize the dynamic range of the system. the calibration to find the best working point shou ld be calculated and set by means of the controlle r over the spi interface. 8.1.1 8.1.1 8.1.1 8.1.1. .. . transimpedance amplifier (tia) transimpedance amplifier (tia) transimpedance amplifier (tia) transimpedance amplifier (tia) the transimpedance amplifier converts the photocurr ent of the connected photodiode into a voltage sign al. the overall transfer function for the active light channels is defined by following formula : k buf gain adj gain buf gain t activeligh adc i pd + ?? ? ?? ? ? = _ _ 02.0 _ 45.1 3.3 2 1 65535 _ ? i pd : the current through the photo diode (in a) ? adc_activelight : the decimal value of the active l ight measurement (see output data frame of read-out ) ? gain_buf : the gain value selected by the gainbuf r egister ? gain_adj : the gain value selected by the setal or setbl register ? k : factor causing by signal attenuation from tia. range from 50% - 90%. the tias dc-light cancellation circuitry delivers a 16bit value of the received (external) dc light.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 16 of 16 39010xxxxx 8.1.2 8.1.2 8.1.2 8.1.2. .. . active light active light active light active light channel dc light measurement channel dc light measurement channel dc light measurement channel dc light measurement the dc current compensation circuitry of the transi mpedance amplifier is able to supply and measure th e dc current supplied to the photodetector. both acti ve light channels are identical in structure. in order to reach a feasible resolution in the curr ent range of interest (low currents in the range up to 900ua), the measurement characteristics will satura te for currents above the idc current range, howeve r the compensation circuit is nevertheless able to su pply the specified current levels to the detector ( up to 900ua). the given adc word length for the active li ght channel dc light data is 16bit. the typical transfer function of dc measurement is defined by formula: 35 1760 _ _ ? = dc adc i dc pd i pd_dc : the dc current through photo diode (in ua). adc_dc : the decimal value of the dc measurement ( see output data frame of read-out).
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 17 of 17 39010xxxxx 8.2 8.28.2 8.2. .. . ambient light sensor ambient light sensor ambient light sensor ambient light sensor 8.2.1 8.2.1 8.2.1 8.2.1. .. . normal operation normal operation normal operation normal operation the ambient light detection system of the mlx75031 consists of two independent channels c & d and an on-chip controllable dedicated ground pin gndamb. g ndamb is internally set to gnda in normal operation. an external photodiode is connected in b etween each channel and gndamb. the base-emitter diode of a bipolar transistor generates a logarithm ic transfer function from the incoming photocurrent to an internal voltage. please refer to the mlx75031 emc guidelines to improve the emc resistance of the ambient channels 8.2.2 8.2.2 8.2.2 8.2.2. .. . logarithmic transfer function logarithmic transfer function logarithmic transfer function logarithmic transfer function following graphs show the input current to output a dc value characteristic of each ambient channel.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 18 of 18 39010xxxxx figure 2: input-to-output characteristic of each am bient channel at 3 different temperatures 8.2.3 8.2.3 8.2.3 8.2.3. .. . calibration & temperaure compensaion calibration & temperaure compensaion calibration & temperaure compensaion calibration & temperaure compensaion the output of each ambient channel has a strong tem perature dependence and a slight process dependence that can be compensated at run time. thi s is shown in following equation (channel x, x = c, d) : ( ) + ? ?? ? ? ?? ? ? ?? ? ?? ? ? + ? + = t ambout t o t tc i x x iref x 15 2 2 300 1 1 e (1) ? i x : calculated input light value ? ambout x : 16-bit adc converted value of the ambient channe l ? tc iref : temperature coefficient of the reference curren t (typ. value = +1230ppm/k) ? o x : offset of the internal amplifiers (digital value ) ? x , x : calibration values for channel x (see below)
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 19 of 19 39010xxxxx during calibration at least 2 light levels (i x1 and i x2 ) have to be supplied to the target ambient channel (x) with its photodiode at the same known temperature t . the closer these values are chosen to the range used in application, the more accurate the final re sult will be. during the setting of these two light levels, the output of ambient channel x: ambout x1 and ambout x2 are measured. this results in 2 equations and 2 unknowns: x and x . both unknowns can be calculated from following fo rmulas : 2 1 2 1 ln ambout ambout i i t ? ? ?? ? ? ?? ? = and ? ?? ? ? ?? ? ? ? ?? ? ?? ? = t ambout i 15 1 1 2 1 ln (2) note : these 2 values automatically correct any gai n error of the connected photodiode and used lens system. after the calibration step, some error remains when the temperature deviates from the calibration temperature. the error depends on the temperature d rift of the reference current (tc iref t) and on the offset ox. in second order, it also depends on the temperature drift of gain g and of the offset ox. with tc iref = + 1230 ppm/k, the ambient current calculation e rror because of the temperature drift of i ref is from -10% at low temperature to +10% at high temper ature. the offset of the ambient signal conditioning chain is between 0 and -20mv (400 lsb). the correspondin g temperature coefficient would be between 0 and -670 ppm/c. the corresponding error in the ambient lig ht calculation would be from 0 to -5.3%. to reduce the mcu load a simple lookup table can be implemented instead of the complete formula. 8.2.4 8.2.4 8.2.4 8.2.4. .. . response time response time response time response time during operation, each ambient channel constantly s hows a logarithmic output response towards the inpu t current that is applied. as a result, the time for the output to respond on a changing input current i s defined by a strongly non-linear function (similar but not equal to an rc-curve). therefore a threshold cross ing criterion is used to define the time response. the light threshold level is defined as a border be tween light and dark. this threshold can be defined as a light level of a voltage level at the output of the ambient light channel. if the light suddenly cross es the defined light threshold, the output of the ambient light channel will cross the corresponding voltage threshold with a delay. this delay is the response time. figure 3 shows an example of such a threshold cross ing. an input current step is used as this represen ts the worst case condition. note that starting from an in put current level that is close to the threshold, t he end requirement of 20% below or 80% above can be heavil y relaxed. the ambient light response time is valid for any th reshold level equal to or above the defined input threshold level i ambx_detect of any input channel.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 20 of 20 39010xxxxx figure 3 : ambient response time explanation 8.2.5 8.2.5 8.2.5 8.2.5. .. . diagnostics mode operation diagnostics mode operation diagnostics mode operation diagnostics mode operation in diagnostics mode, the status of the external pho todiodes is checked. a set of switches controls the different possible e rror conditions by running through the different te sts. at the end of this check, all switches go back into th e initial position to allow normal ambient light de tection. table 11 lists the possible error modes for detecto r c and pin gndamb. the error modes for detectors d are equivalent. failure detected how detc disconnected diagnostics if checkc == 0: error ! gndamb disconnected diagnostics identical test as d etc disconnected. detc shorted to gnda/gndd/gndamb normal mode ? ambient detector shows incredible high light input ? adc response is much likely saturated, anyway the output is far beyond the allowed operation range diagnostics if checkc == 0: error! detc shorted to vcca/vccd diagnostics if checkc == 1: error! gndamb shorted to gnda/gndd various ? this is no problem for normal operation ? this can be a problem in testmode if short is stron g and pin gndamb pulled to vdda: a maximum current of 50m a can be pulled during 10s ? if so, test for detc disconnected will show an erro r gndamb shorted to vcca/vccd normal mode a maximum current of 800ma can be pulle d from this driver diagnostics if the current can be supplied by the module, an er ror will be flagged similar to detc shorted to vcca/vccd detc shorted to detd diagnostics ? if checkc == 0: error! ? if checkd == 1: error! table 11 : list of possible failures on the ambient pins C projected on channel c. note that in spite of the ability to detect any err or by the ambient diagnostics, an error on an ambie nt pin might still have other unwanted effects. ? time input current time output value light response time light response time input threshold level corresponding output threshold level 20% 80%
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 21 of 21 39010xxxxx ? shorting any channel to gnda/gndd/gndamb will make t he readout of the whole ambient block useless. at this time a maximum current of 14ma mig ht be constantly pulled from the supply, independent of the amount of channels that is short ed to gnda/gndd/gndamb. ? during normal operation, node gndamb should be consi dered a ground pin. shorting this pin to any other voltage might result in a shortcurrent of max 800ma! ? because of such unwanted effects, a detection of an error in diagnostics mode should be followed by a disabling of the ambient channels in order to avoid disturbing the operation of other blocks in the system. ? note that unused channels should be connected with an external resistance (~60kohm) to gndamb. doing so will avoid disturbing the other ch annels, but will give a constant error on the channel connected to gndamb. 8.3 8.38.3 8.3. .. . temperature sensor temperature sensor temperature sensor temperature sensor the on-chip temperature sensor measures the ic temp erature. the output voltage of the sensor is converted by the 16-bit adc. the sensor will be tri mmed for the best result during the production. thi s trimming value is not applied to the temperature se nsor internally, but is available to the customer t hrough two on-chip registers calib1 and calib2, see 0. the calib1 register contains the slope of the temperat ure curve in lsb/k. the calib2 register contains the of fset of the curve at a defined temperature at which the chip is tested in production. an exemplary plot for the temperature sensor is given in figure 4 : temperature sensor exemplary graph. figure 4 : temperature sensor exemplary graph mlx75308ba temperatures [deg.c] vs. adc out of temp erature sensor (slope and offset depends on calib1 and calib2) -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 20250 19750 19250 18750 18250 17750 17250 16750 16250 15750 15250 14750 14250 13750 13250 12750 12250 11800 11300 10800 10300 9800 9300 8800 8300 7800 7300 6800 6300 5800 5300 4800 4300 3800 3300 2800 adc output of temperature sensor [lsb] temperature [deg. c] 0 0 0 16 0 32 0 48 0 63 8 0 8 16 8 32 8 48 8 63 24 0 24 16 24 32 24 48 24 63 31 0 31 16 31 32 31 48 31 63 16 32 calib1 calib2 bold green calib1 = 16 / calib2 = 32: -> no offset at 30 deg. c and -> slope is -67 lsb/k mlx75031ba temperatures [deg.c] vs. adc out of temp erature sensor
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 22 of 22 39010xxxxx the temperature is calculated from the temperature readout ( tempout ) and the gain and offset calibration data (calibration data measured at 30c) according to the formula : ( ) )16 1 ( 67 )32 2 ( 67 11781 15. 303 ? + ? ? + + = calib tempout calib k t k k or in c: ( ) )16 1 ( 67 )32 2 ( 67 11781 c 30 ? + ? ? + + = calib tempout calib t c ? tempout : digital temperature readout (16bit) ? calib1 : contents of calib1 register (5bit) ? calib2 : contents of calib2 register (6bit) 8.4 8.48.4 8.4. . . . analog to digital conversion analog to digital conversion analog to digital conversion analog to digital conversion the adc converts all mux signals in a 16 bit word w hich is passed in a register in the digital block a nd can be read out through the spi interface. 8.5 8.58.5 8.5. .. . output stage output stage output stage output stage 8.5.1 8.5.1 8.5.1 8.5.1. .. . dac dac dac dac for the mlx75031 active light application, the dac has been designed to generate a pulse voltage signa l from 1mv to 1v, so that led current driven by the l ed driver can be 1ma to 150ma, if a 6.6? external resistor is used. a logarithmic dac was used. a piece-wise linear dac with four zones is implemen ted as approximation for the logarithmic dac. dac piece (dacx[7:6]) steps in each piece (6lsbs dacx[5:0] ) step size for 1 bit (v) trasfer function vdac (v) = range start (v) range end (v) 00 64 1.00e-04 1.00e-04*dacx[7:0] + 1.03e-3 1.03e-0 3 7.43e-03 01 64 5.10e-04 5.10e-04*dacx[7:0] - 2.491e-2 7.56e- 03 3.952e-02 10 64 2.52e-03 2.52e-03*dacx[7:0] - 2.820e-01 4.022 e-02 1.988e-01 11 64 1.224e-02 1.224e-02*dacx[7:0] - 2.145 2.057e- 01 9.769e-01 table 12 : the dac voltage values based on the dac codes (dacx[7:0], x=a or b) at vdd=3.3v
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 23 of 23 39010xxxxx figure 5 : piece wise linear dac voltage vs dac cod es 8.5.2 8.5.2 8.5.2 8.5.2. .. . led driver led driver led driver led driver the led driver mainly contains one operational ampl ifier and transistors able to drive the external le ds. its task is to set the voltage over the external rs hunt equal to the voltage generated by dac, so the corresponded current (vdac/ rshunt) is flowing thro ugh led. the error flag err_drv is set high if the led curre nt regulation loop is broken (disconnected led or s hunt resistor). 8.5.3 8.5.3 8.5.3 8.5.3. .. . led forward voltage measurement led forward voltage measurement led forward voltage measurement led forward voltage measurement when the current pulse is flowing through the led, the voltage drop across the led (between pin drive_leda/b and pin shuntr) is sampled and then he ld for later adc conversion. this value can be used to estimate the led temperat ure. the sampling occurs synchronously with the active l ight signal sampling. piece wise linear dac voltage vs dac codes 0 0.2 0.4 0.6 0.8 1 1.2 0 50 100 150 200 250 300 dac codes (lsb) dac voltage (v)
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 24 of 24 39010xxxxx the overall transfer function for the led temperatu re sensing is defined by following formula: ( ) led adj os led adj g ledtemp adc v led _ _ 2 _ _ 65535 64.6 32768 _ + ? = ? v led : the voltage between pin drive_leda/b and pin shun tr (in v) ? adc_ledtemp : the decimal value of the led tempera ture measurement (see output data frame of read-out) ? g_adj_led: the gain value selected by the setpls re gister ? os_adj_led: the offset value selected by the setpls register (in v) due to different led types and led connections, the gain g_adj_led and os_adj_led shall be set such th at the measurement range fits the application the best way. minimum v led measurement resolution is typical 0.5mv. 8.5.4 8.5.4 8.5.4 8.5.4. .. . bat batbat batt tt ter erer ery yy y supply voltage measuremen supply voltage measuremen supply voltage measuremen supply voltage measurement tt t & monitoring & monitoring & monitoring & monitoring the voltage on the vsup pin is continuously monitored. in case the voltage on the pin goes above 20v typical, the error flag err_vsuph will be set and t he led driver will be shut off. active light measur ements can still be executed but the led driver will be di sabled as long as vsup > 20v typical, protecting th e led's from being damaged. the error flag err_vsupl will be set when the volta ge on vsup goes below the threshold defined by the two bits vsuplow<1:0>. the led driver will remain activ e. active light measurements are still possible. in figure 6 the definition of the thresholds is sho wn. it is indicated when the certain error conditio ns are present and when the error flags are set. figure 6 : threshold definitions of vsup monitoring block error condition on high threshold error condition on low threshold vt supl =6v vt suph =20v vt suph -vt suph_hys =18.5v vt supl +vt supl_hys =6.75v led driver is disabled in this time err_vsuph is set err_vsupl is set time vsup voltage
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 25 of 25 39010xxxxx besides this continuous monitoring, it is possible to do a vsup voltage measurement on request. this is included in the measurement sequence 1 of t he start measurement command. please refer to section 8.11.4 for more information . the overall transfer function for the vsup measurem ent is defined by following formula : 13107 _ 6.16 vsup adc v sup = ? v sup : the voltage on the pin vsup (in v) ? adc_vsup: the decimal value of the vsup measurement (see output data frame of read-out) 8.6 8.68.6 8.6. .. . power power power power- -- -on reset on reset on reset on reset the power on reset (por) is connected to voltage su pply. at power-on the por cell generates a reset signal b efore the supply voltage exceeds a level of v por-on . the cell contains a hysteresis of 100mv. figure 7 : por sequence 8.7 8.78.7 8.7. .. . oscillator (rc) oscillator (rc) oscillator (rc) oscillator (rc) the integrated oscillator has to provide a clock si gnal to the digital control logic, the watchdog tim er and the adc. the oscillator will run with a frequency at 2. 5mhz, all other components with 1.25mhz. the drift of f osc over temperature and supply voltage is smaller tha n 8%. the oscillator can be enabled and disabled when cha nging the modes (nrm/stby Cslp). it is active in normal mode and in standby mode. in sleep mode, it is disabled. 8.8 8.88.8 8.8. .. . adc mux adc mux adc mux adc mux the adc multiplexer transfers the various voltages of interest to the ad converter. hysteresis vdd v por - off v por - on vpor
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 26 of 26 39010xxxxx 8.9 8.98.9 8.9. .. . vstab analog +bandgap vstab analog +bandgap vstab analog +bandgap vstab analog +bandgap this block generates all reference voltages and cur rent sources for the analogue blocks. these sources work as far as possible independent f rom the temperature. the block is also switched off in standby and sleep mode and has a wake up functionality with the smal lest possible time. 8.10 8.10 8.10 8.10. .. . digital control digital control digital control digital control the digital control is responsible for all clock an d gating signals used within the ic. these signals control the led drive sequence, the sampling and conversion of the photo-diode inputs, and so on. the digital control is also responsible for channel ing data to and from the spi interface. 8.11 8.11 8.11 8.11. .. . spi spi spi spi 8.11.1 8.11.1 8.11.1 8.11.1. .. . general description of the spi in general description of the spi in general description of the spi in general description of the spi interface terface terface terface after power-on, the sensor enters a reset state (in voked by the internal power-on-reset circuit). a st art-up time tstartup after power-on, the internal referenc e voltages have become stable and a first measureme nt cycle can start. to indicate that the start-up phas e is complete, the dr pin will go high (dr is low d uring the start-up phase). the control of this sensor is completely spi driven . for each task to be executed, the proper command must be uploaded via the spi. the spi uses a four-wire c ommunication protocol. the following pins are used: cs : when cs pin is low, transmission and reception a re enabled and the miso pin is driven. when the cs pin goes high, the miso pin is no longer driven and becomes a floating output. this makes it possible that one micro-processor takes control ove r multiple sensors by setting the cs pin of the appropriate sensor low while sending commands. the idle state of the chip select is high. sclk : clock input for the sensor. the clock input must be running only during the upload of a new command or during a read-out cycle. the idle state of the clock input is high. mosi : data input for uploading the different commands a nd the data that needs to be written into some registers. the idle state of the data input is low. miso : data output of the sensor. a spi timing diagram is given in figure 8. this is the general format for sending a command. first the cs pin must be set low so that the sensor can accept data. the low level on the cs pin in combination with th e first rising clock edge is used to start an internal sync hronization counter that counts the incoming bits. data on the mosi pin is clocked in at the rising clock edge . data on the miso pin is shifted out during the fa lling clock edge. note that the tri-state of the miso pin is controlled by the state of cs. after uploading a command, the cs pin must be set h igh for a minimum time of tcs_inter in order to res et the internal synchronization counter and to allow n ew commands to be interpreted.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 27 of 27 39010xxxxx figure 8 : spi timing diagram for 2 byte instructio ns the basic structure of a command consists of 2 byte s: the control1 byte and the control2 byte that are uploaded to the device and the data1 byte and the d ata2 byte that are downloaded to the micro-controll er. exceptions are the commands needed to read and writ e the user registers (wr/rr). these commands need 3 bytes. the timing diagram is given in figure 9. all data transfer happens with msb first, lsb last. referring to figure 8 and figure 9 within a byte, bit 7 is always defined as the msb, bit 0 is the lsb. this a pplies to all data transfers from master to slave a nd vice versa. figure 9 : spi timing diagram for 3 byte instructio ns the msb of the control1 byte (bit 7) is a command t oken: setting this bit to 1 means that the control1 byte will be interpreted as a new command. if the msb i s 0, the next bits are ignored and no command will be accepted. the idle command has a control1 byte of 0 x00. the command type (chip reset, watchdog trigger, pow er mode change, start measurements, start read-out, read/write register) is selected with the next bits 6..0 of the control1 byte. the control2 byte consists of 0x00, to allow clocki ng out the data2 byte. the data2 byte contains alwa ys the ctrl1 byte that was uploaded. thus the micro-co ntroller can check that the data2 byte is an exact replica of the ctrl1 byte, to verify that the right command is uploaded to the device.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 28 of 28 39010xxxxx the data1 byte contains some internal status flags to allow checking the internal state of the device. the internal status flags are defined in the table below (table 13). see section 0 for more information concerning the operation of the status flags. status flag status when bit is set status when bit is clear bit 7 (msb) previous command was invalid previous c ommand was valid bit 6..5 power state: 11 = (reserved) 10 = normal running mode 01 = stand-by state 00 = sleep state bit 4 sleep request was sent no sleep request avail able bit 3 standby request was sent no standby request a vailable bit 2 device is in testmode device is not in testmo de bit 1 internal oscillator is enabled (standby mode or normal running mode) internal oscillator is shut down (sleep mode) bit 0 (lsb) critical error occurred no error is det ected table 13 : internal status flags as given in the da ta1 byte table 14 summarizes the instruction set of the sens or. a detailed explanation of these different commands is given in section 8.11.3. symbol command description control1 byte control2 byte control3 byte nop idle command 0000 0000 0000 0000 n/a cr chip reset 1111 0000 0000 0000 n/a wdt watchdog trigger 1001 0011 0000 0000 n/a rslp request sleep 1110 0001 0000 0000 n/a cslp confirm sleep 1010 0011 0000 0000 n/a rstby request standby 1110 0010 0000 0000 n/a cstby confirm standby 1010 0110 0000 0000 n/a nrm normal running mode 1110 0100 0000 0000 n/a sm start measurement 1101 00r0t m6..m3 m2m1m0p n/a sd start diagnostics 1011 0000 0000 0000 n/a ro start read-out 1100 0011 0000 0000 n/a wr write register 1000 0111 d7..d0 a3..a0 p1p000 rr read register 1000 1110 a3..a0 0000 0000 0000 table 14 : instruction set of the active light sens or besides the above instruction set, there are some t est commands available for production test purposes . to prevent unintentional access into these test modes, it requires multiple commands before the actual te st mode is entered.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 29 of 29 39010xxxxx 8.11.2 8.11.2 8.11.2 8.11.2. .. . operation modes operation modes operation modes operation modes the mlx75031 can work in three operation modes : 1. normal mode : normal operation is the state during which all inte rnal blocks are powered on (default state after pow er- on). measurement sequences and their conversion to digital values are regularly ongoing. the pin sleepb is set high when the device is in no rmal mode. 2. standby mode : standby mode is defined as the state in which only the watchdog and oscillator is active. the pin sleepb is set low when the device is in sta ndby mode. 3. sleep mode : in sleep mode the complete system is switched off. only the spi can work. the optical gesture & proximity sensing ic can swit ch in the normal mode via spi. the pin sleepb is set low when the device is in sle ep mode. an overview of modes in which the device can operat e is shown in figure 10 below. it is also indicates which commands are available in the different operation m odes and it shows the state of the different flags in the status flags byte. figure 10 : state diagram of the mlx75031
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 30 of 30 39010xxxxx 8.11.3 8.11.3 8.11.3 8.11.3. .. . detailed explanation of spi instruction words detailed explanation of spi instruction words detailed explanation of spi instruction words detailed explanation of spi instruction words 8.11.3.1 8.11.3.1 8.11.3.1 8.11.3.1. .. . nop nop nop nop C CC C idle command idle command idle command idle command the idle command can be used to read back the inter nal status flags that appear in the data1 byte. the state of the device is not changed after the no p command is uploaded. 8.11.3.2 8.11.3.2 8.11.3.2 8.11.3.2. .. . cr cr cr cr C CC C chip chip chip chip reset reset reset reset command command command command after upload of a chip reset command, the sensor re turns to a state as it is after power-up (normal ru nning mode) except for the watchdog counter, the state of the mr line and the contents of the 'rst' register. the watchdog counter, the 'rst' register and the state of the mr line will not be influenced by a cr command. the cr command can be uploaded at any time, even du ring a measurement or a read-out cycle, provided that the internal synchronization counter is reset. this is done by setting the cs pin high for at least a time t cs_inter . when a cr command is uploaded during sleep mode res p. standby mode, the device goes automatically into normal running mode. note that this requires a time t wakeup_slp resp. t wakeup_stby before the internal analog circuitry is fully set up again. right after upload of a cr command, the dr pin will go low during a time t startup . once the wake-up/reset phase is complete, the dr pin will go high. 8.11.3.3 8.11.3.3 8.11.3.3 8.11.3.3. .. . rslp/cslp rslp/cslp rslp/cslp rslp/cslp C CC C request sleep/confirm sleep request sleep/confirm sleep request sleep/confirm sleep request sleep/confirm sleep to avoid that the slave device goes unintentionally into sleep mode, the master has to upload two commands. first a rslp (request sleep) shall be upl oaded, then the slave sets bit 4 of the internal st atus flag byte high. the master has to confirm the sleep request by uploading a cslp (confirm sleep). after wards the slave will go into sleep mode, hereby reducing the current consumption, and the pin sleepb will switch to low indicating that the device state changed int o sleep mode. the pin sleepb will change state a time t sleepb after the pin cs is set high at the end of the cslp command. the status flag can be cleared by uploading a cr co mmand or a nrm command. note that uploading a chip reset makes the device s witching into normal running mode. the state of the dr pin will not be changed when go ing into sleep mode. however, after a wake-up event the dr pin is set low during a time t wakeup_slp .
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 31 of 31 39010xxxxx 8.11.3.4 8.11.3.4 8.11.3.4 8.11.3.4. .. . r rr rstby/cstby stby/cstby stby/cstby stby/cstby - -- - request request request request standby/confirm standby standby/confirm standby standby/confirm standby standby/confirm standby to put the device in standby mode, a similar system is used: the master shall send the rstby command, requesting the slave to go into standby mode. the s lave device sets bit 3 of the internal status flag byte high, indicating that it wants to go into standby. the master has to confirm this by sending the cstby byte. the pin sleepb will be set low a time t sleepb after the pin cs is set high at the end of the cstby command. the status flag can be cleared by uploading a cr co mmand or a nrm command. note that uploading a chip reset makes the device s witching into normal running mode. the state of the dr pin will not be changed when go ing into standby mode. however, after a wake-up eve nt the dr pin is set low during a time t wakeup_stby . 8.11.3.5 8.11.3.5 8.11.3.5 8.11.3.5. .. . nrm nrm nrm nrm C CC C normal running mode normal running mode normal running mode normal running mode the nrm command shall be used to wake up the device from sleep mode, or to go from standby into normal running mode. this requires a time t wakeup_slp resp. t wakeup_stby before the internal analog circuitry is fully set up again. the nrm will also clear the sle ep request or standby request flag. when the device wakes up from standby or sleep mode , the pin sleepb will go high, to indicate that the device state changed into normal running mode. the t sleepb time is not applicable in case of wake-up. when the nrm command is uploaded during normal runn ing mode, the state of the device will not be influenced, except when the sleep request or standb y request flag was set high due to a rslp or rstby command. in this case, the sleep request or standby request flag will be cleared; the state of the dr pin will not change.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 32 of 32 39010xxxxx 8.11. 8.11. 8.11. 8.11.4 44 4. .. . sm smsm sm C CC C start measurement start measurement start measurement start measurement the sm command is used to start up measurement cycl es. two different measurement sequences can be selected with option bit m 6 : ? setting m 6 high enables the measurement sequence 1, wherein t he two ambient light channels, the die temperature and the voltage on the vsup pin are measured ? setting m 6 low enables the measurement sequence 2, wherein th e dc light, the active light, the led temperature and the voltage on the vsup pin during the active light pulse are measured. when m 6 is set low, 4 other option bits are available in o rder to select the led that needs to be fired and to select the active light channel that n eeds to be read out: - m 3 : setting this bit high fires led a and measures th e temperature of led a - m 2 : setting this bit high fires led b and measures th e temperature of led b - m 1 : setting this bit high enables the active light me asurement in channel a - m 0 : setting this bit high enables the active light me asurement in channel b the table below gives the overview of available opt ions bits in the sm command. control2 bits measurement sequence 1 measurement sequence 2 m6 set to 1 set to 0 m5 set to 0 set to 0 m4 set to 0 set to 0 m3 set to 0 1 = fire + measure temperature of led a 0 = don't fire + measure temperature of led a m2 set to 0 1 = fire + measure temperature of led b 0 = don't fire + measure temperature of led b m1 set to 0 1 = measure active light on channel a 0 = dont measure active light on channel a m0 set to 0 1 = measure active light on channel b 0 = dont measure active light on channel b available measurements die t emperature ambient light channel c ambient light channel d battery voltage dc l ight before active light pulse battery voltage during active light pulse active light measurements temperature of led table 15 : available option bits in sm command a typical timing diagram is given in figure 11. aft er uploading the sm command, the measurement cycle is started as soon as the cs pin is set high. the adc starts converting all the needed analog voltages and stores the digital values in registers. a time t cs_dr after cs is set high, the state of the dr pin goes low. a time t dr after dr was set low, the state of the dr pin becomes high, indicating that all measurements are completed and that the resulted data is available for read-out (read-back of the stored dat a in the registers). this time can be up to 239us, if an internal auto-zeroing process is under execution an d needs to be finished.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 33 of 33 39010xxxxx table 16 : basic measurement execution times tdr note : the dr pin can be used as an interrupt for the master dev ice as it indicates when a read-out cycle can be started. figure 11 : timing diagram of a measurement cycle the sm command contains 2 option bits: r0 & t. the bit r0 sets the polarity of the adc input buffer in active light channels a & b. the bit t provides tes t pulses during the active light measurements. ? r0: inversion of the offset of the adc_buffer. the output will change from (signal + offset_opamp_buf) to (signal - offset_opamp_buf). i n this way, by processing 2 measurements with inverted r0 bits, the offset of the adc buffer filt er can be cancelled. ? t: this bit replaces the light pulses by internal c urrent pulses during the active light measurements. the led driver will not be activated when this opti on bit is selected. the sm command contains an option bit t. if this bi t is set to 0, normal active light measurements are performed (i.e. the external led's are fired and th e active light channels a and/or b are measured). i f this bit is set to 1, no led's are fired, but an interna l test pulse is applied to channels a and/or b. the internal test pulse can be influenced in amplitude by the bi ts daca7 and daca6 (when led a is fired) or by the bits dacb7 and dacb6 (when led b is fired). daca7/ dacb7 daca6/ dacb6 i_testpulse [ua] typical adc value [lsb] at default tp & gain settings 0 0 5 8466 0 1 13 14737 1 0 21 20967 1 1 29 27195 table 17 : current levels for active light testmode . measurement type min. tdr (s) max. tdr (s) measurement sequence 1 520 611 measurement sequence 2: measure one active light channel with typical tdc_pulse<1:0> and typical tp<2:0> settings 786 924 measurement sequence 2: measure one active light channel with maximum tdc_pulse<1:0> and maximum tp<2:0> settings 1024 1203 measurement sequence 2: measure two active light channels with typical tdc_pulse<1:0> and typical tp<2:0> settings 921 1082 measurement sequence 2: measure two active light channels with maximum tdc_pulse<1:0> and maximum tp<2:0> settings 1159 1361 cs sclk mosi miso tri state tri state dr sm/sd command t dr internal state idle state measurement cycle sm/sd idle state status flags/ctrl 1 t cs_dr
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 34 of 34 39010xxxxx in the control2 byte an even parity bit p is forese en. the parity bits calculation is based on the measurement selection bits m 6 ..m 0 . if the number of ones in the given data set [m 6 ..m 0 ] is odd, the even parity bit p shall be set to 1, making the total nu mber of ones in the set [m 6 ..m 0 , p] even. the spi invalid flag will be set when the parity bi t does not correspond to the calculated parity bit. after upload of a sm/sd command, no other commands will be accepted till dr is high. this is done to avoid too much disturbances in the analog part. once dr is high, the next command will be accepted. an exception however is the chip reset command. this w ill always be accepted. note : none of the sm/sd commands are available in standby and sleep mode. 8.11.5 8.11.5 8.11.5 8.11.5. .. . ro ro ro ro C CC C start read start read start read start read- -- -out out out out when the state of the dr pin changed into a high state, the measurement dat a is available for read-out. the ro command shall be uploaded to start a read-ou t cycle and to start reading out the data that was stored in the internal registers. to make sure that no memory effects can occur, all data registers are cleared at the end of each r ead-out cycle. a typical timing diagram is given in figure 12 belo w: figure 12 : timing diagram for read-out note : the ro command is not available in standby a nd sleep mode. the data that appears on the miso pin depends on the type of measurement that was do ne (i.e. it depends on the command that was uploaded: sm/sd and the sel ected option bits m 6 ..m 0 ). cs sclk mosi miso tri state tri state dr ro-ctrl1 8t sclk x*8t sclk output data frame x bytes sm1x/sm2/sm3x command t dr 8t sclk status flags 1 byte ctrl1 1 byte ro-ctrl2 t cs_dr
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 35 of 35 39010xxxxx the table below shows the output data frame when me asurement sequence 1 is selected : data byte number output data frame contents - measurement sequence 1 comments byte 3 die temperature measurement (8 msb) depends on en_temp byte 4 die temperature measurement (8 lsb) depends on en_temp byte 5 ambient light \ channel c measurement (8 msb) depends on en_ch_c byte 6 ambient light channel c measurement (8 lsb) depends on en_ch_c byte 7 ambient light channel d measurement (8 msb) depends on en_ch_d byte 8 ambient light channel d measurement (8 lsb) depends on en_ch_d byte 9 internally reserved register reserved byte 10 internally reserved register reserved byte 11 battery voltage measurement (8 msb) depends on en_vsupmon byte 12 battery voltage measurement (8 lsb) depends on en_vsupmon byte 13 crc (8 bit) output always table 18 : sm output data frame - measurement seque nce 1 the table below shows the output data frame when me asurement sequence 2 is selected : data byte number output data frame contents - measurement sequence 2 comments byte 3 dc measurement of ir channel a (8 msb) depen ds on m1 + on en_ch_a byte 4 dc measurement of ir channel a (8 lsb) depen ds on m1 + on en_ch_a byte 5 dc measurement of ir channel b (8 msb) depends on m 0 + on en_ch_b byte 6 dc measurement of ir channel b (8 lsb) depends on m 0 + on en_ch_b byte 7 battery voltage measurement during active light pul se (8 msb) depends on en_vsupmon byte 8 battery voltage measurement during active light pul se (8 lsb) depends on en_vsupmon byte 9 active light measurement of ir channel a (8 msb) depends on m1 + on en_ch_a + led selection depends on m3/m2 byte 10 active light measurement of ir channel a (8 lsb) depends on m1 + on en_ch_a + led selection depends on m3/m2 byte 11 active light measurement of ir channel b (8 msb) depends on m0 + on en_ch_b + led selection depends on m3/m2 byte 12 active light measurement of ir channel b (8 lsb) depends on m0 + on en_ch_b + led selection depends on m3/m2
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 36 of 36 39010xxxxx byte 13 temperature of led that was fired (8 msb) depends on en_ledsens + led selection depends on m3/m2 byte 14 temperature of led that was fired (8 lsb) depends on en_ledsens + led selection depends on m3/m2 byte 15 crc (8 bit) output always table 19 : sm output data frame - measurement seque nce 2 when certain measurement blocks are disabled, the c orresponding data bytes are omitted from the output data frame. cyclic redundancy check calculation in all output data frames, a crc byte is included a s last byte. this byte provides a way to detect transmission errors between slave and master. an ea sy method to check if there were no transmission errors is to calculate the crc of the whole read-ou t frame as defined in previous tables. when the calculated crc results in 0x00, the transmission wa s error free. if the resulting crc is not equal to zero, then an error occurred in the transmission and all the d ata should be ignored. for more information regarding the crc calculation, please refer to section 8.18. 8.11.6 8.11.6 8.11.6 8.11.6. .. . d dd dm+ro m+ro m+ro m+ro - -- - start measurement combined with read start measurement combined with read start measurement combined with read start measurement combined with read- -- -out out out out if after upload of the sm command, extra clocks are given (without putting cs high!), the data stored in the internal registers will appear on the miso pin. at the end of the read-out phase the internal register s will be cleared to avoid memory effects in the next read-ou ts. the newly uploaded sm command will be executed afte r the read-out, when the cs pin goes high. the two figures below show the difference between t he two modes of operation: - figure 13 shows the operation with separate sm an d ro commands. after upload of a sm command, the measurement cycle will start and the internal regis ters will be filled. once the dr pin is high, the r o command can be uploaded to start the read-out cycle . all data of the internal registers will be transf erred and at the end of the read-out the registers will b e cleared. - figure 14 shows the operation with the combined s m and ro. first one has to upload a sm command to start a measurement. the data is available for read -out when the dr pin goes high. instead of uploadin g a ro command, a sm command can be uploaded again to c ombine read-out and the start of the next measurement cycle. if extra clocks are given after upload of the sm command, the data of the internal registers becomes available on the miso pin. note t hat the cs pin shall not be set high until the read -out is finished. once cs pin goes high, the dr pin is set low and a new measurement cycle will be started. a time tdr later the dr pin goes high to indicate that the data is available.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 37 of 37 39010xxxxx figure 13 : separated sm - ro (x value is defined i n figure 12) figure 14 : combined sm - ro (x value is defined in figure 12) 8.11.7 8.11.7 8.11.7 8.11.7. .. . wr/ wr/ wr/ wr/rr rr rr rr - -- - write/read register write/read register write/read register write/read register the slave contains several user registers that can be read and written by the master. the wr and rr commands are used for that. the wr command writes the contents of an 8-bit regi ster addressed by bits a 3..0 with data d 7..0 . data is sent to the device over the mosi pin. control2 byte contains the 8 bit data that sh all be written into the target register. control3 byte contains the address of the target register. the wr command is defined in the table below: control1 byte control2 byte control3 byte 1000 0111 d7d6d5d4 d3d2d1d0 a3a2a1a0 p1p000 d7d6d5d4 d3d2d1d0 a3a2a1a0 p1p0 data contents of register to be written address of target register parity bits (p1 = odd parity bit, p0 = even parity bit) data1 byte data2 byte data3 byte status flag byte 1000 0111 0000 0000 table 20 : write register command cs sclk mosi miso tri state tri state sm/sd 8t sclk 8t sclk status flags 1 byte ctrl1 1 byte idle measurement cycle device state dr 0x00 tri state ro-ctrl1 8t sclk x*8t sclk output data frame x bytes t dr 8t sclk status flags 1 byte ctrl1 1 byte ro-ctrl2 idle read-out idle 0x00 data available filling up 0x00 internal registers emptying t cs_dr cs sclk mosi miso 8t sclk x*8t sclk output data frame x bytes 8t sclk status flags 1 byte ctrl1 1 byte idle measurement cycle device state read-out dr sm/sd 0x00 tri state tri state sm/sd 8t sclk 8t sclk status flags 1 byte ctrl1 1 byte idle measurement cycle 0x00 t dr idle tri state t dr 0x00 data available filling up 0x 00 internal registers emptying data available filling up t cs_dr t cs_dr
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 38 of 38 39010xxxxx in order to detect some transmission errors while w riting data towards the slave device, the micro- controller has to compute an odd and an even parity bit of the control2 and the 4 msb's of the control 3 byte and send these parity bits to the slave. the s lave will check if the parity bits are valid. the d ata will only be written into the registers if the parity bits ar e correct. if the parity bits are not correct, bit 7 of the internal status flag byte will be set high, indicat ing that the command was invalid. this can be seen when uploading a nop command (when one is only intereste d in reading back the internal status flags) or dur ing upload of the next command. in case the parity bits were not correct, the data of the registers will not be changed. the parity bits calculation is based on the data d 7 ..d 0 and a 3 ..a 0 . if the number of ones in the given data set [d 7 ..d 0 , a 3 ..a 0 ] is odd, the even parity bit p 0 shall be set to 1, making the total number of ones in the set [d7..d0, a3..a0, p0] even. similar: if the number of ones in the given data se t [d7..d0, a3..a0] is even, the odd parity bit p1 s hall be set to 1, making the total number of ones in the set [d 7..d0, a3..a0, p1] odd. note that the parity bits can be generated with xor instructions: p1 = xnor(d7..d0, a3..a0) and p0 = xor(d7..d0, a3..a0). the odd parity bit p1 should a lways be the inverse of the even parity bit p0. the rr command returns the contents of an 8-bit reg ister addressed by bits a3..0. data is read back ov er the miso pin. the data1 byte contains the internal status flag byte. data2 byte contains the copy of t he control1 byte. data3 byte contains the 8 bits of th e target register. the rr command is defined in the table below: control1 byte control2 byte control3 byte 1000 1110 a3a2a1a0 0000 0000 0000 a3a2a1a0 address of target register data1 byte data2 byte data3 byte status flag byte 1000 1110 d7d6d5d4 d3d2d1d0 d7..0 data contents of register read table 21 : read register command note : wr and rr commands are commands that require 3 bytes instead of 2 bytes. more information concerning the user registers can be found in section 0. 8.11.8 8.11.8 8.11.8 8.11.8. .. . s ss sd d d d C CC C star star star start diagnostics t diagnostics t diagnostics t diagnostics the sd command will start a measurement cycle in wh ich internal signals will be measured and converted . with this command it is possible to test some circu its in the chip and check if they are functioning a s expected. the sd command behaves in much the same way as the sm commands: instead of uploading a sm command, a sd command can be uploaded. this starts the measurement cycle and conversion of some internal signals. the pin dr goes high when the cyc le is completed, indicating that a read-out can be started. with the ro command it is possible to read out the data and check if all the data values are within ce rtain ranges.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 39 of 39 39010xxxxx after upload of a sd command, no other commands wil l be accepted till dr is high. this is done to avoi d too much disturbances in the analog part. once dr is hi gh, the next command will be accepted. an exception however is the chip reset command. this will always be accepted. the sd command is not available in standby mode. the execution time tdr for the diagnostics measurem ents is between 605s and 712s. the output data frame is defined in the table below : data byte number data byte contents after sd command byte 3 adctest0 (8 msb) byte 4 adctest0 (8 lsb) byte 5 adctest1 (8 msb) byte 6 adctest1 (8 lsb) byte 7 adctest2 (8 msb) byte 8 adctest2 (8 lsb) byte 9 adctest3 (8 msb) byte 10 adctest3 (8 lsb) byte 11 dac-adc test (8 msb) byte 12 dac-adc test (8 lsb) byte 13 00000 + cde ambient diodes detection (3 bit ) byte 14 crc (8 bit) table 22 : sd output data frame adctest0/1/2/3 these measurements are ad conversions of some inter nal reference voltages: ? adctest0 is typically at 1/16 of the adc range: adc test0 = 0x0e00 .. 0x1200. ? adctest1 is typically at 1/4=4/16 of the adc range: adctest1 = 0x3e00 .. 0x4200. ? adctest2 is typically at 15/16 of the adc range: ad ctest2 = 0xee00 .. 0xf200. adctest3 is similar to adctest0/1/2: an ad conversi on of an internal reference voltage is made. howeve r, an independent voltage reference is used as input f or the adc in case of adctest3. in the case of adctest0/1/2, the reference voltages are generated from the references used for the adc. the typical output for adctest3 will be at half of the adc range: adctest3 = 0x7888 .. 0x89d0. these v alues are valid for vdd=3.3v +/-2%. dac-adc test a dac-adc test measurement is performed in the foll owing way: the dac output is connected to the adc input. the dac input will be daca<7:0> from registe r 'setah'. this dac-input will be converted to an a nalog output voltage that will be converted again by the adc to give a digital value. this digital value is given in the bytes dac-adc test. note that the values writte n to daca<7:0> should be limited to the range 0x80..0xff during the dac-adc test.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 40 of 40 39010xxxxx in section section 8.5.1 the typical dac output vol tage is given for a certain code, call this voltage vdac (in v). then the following formula applies: adc_out = 1 9721*vdac + 32768, where adc_out is the decimal value of the dac-adc test word in the output data f rame. ambient diodes detection during the diagnostics measurement, the status of t he external photo diodes connected to the ambient light channel inputs is checked. three bits b'cde are output: when the bit c is set high, an error on the photodiode channel c is prese nt. in a similar way, bits d and e indicate if errors on amb ient light channels d and e are present or not. 8.12 8.12 8.12 8.12. .. . i ii internal status flags nternal status flags nternal status flags nternal status flags bit 7: previous command invalid/valid when an uploaded command is considered invalid, bit 7 will be set high. this bit can be read out when the next command will be uploaded. if the next command is valid, bit 7 will be cleared again. a command is considered invalid in case : - a command is unknown (i.e. all commands that are not mentioned in table 14) - the parity bit in the sm or sd command is not cor rect - the parity bits in a wr command are not correct - when a command (except the cr command) was sent d uring a measurement cycle (i.e. after uploading a sm/sd command, when dr is still low) - when a ro command was sent when dr is low (at any time, i.e. not only after uploading a sm/sd command) - if a '1' is written into one of the bits of the ' err' register - if a wdt command is uploaded while the device is in sleep mode bit 6..5: power state, bit 4: sleep request, bit 3: standby request the behaviour of the power state and the sleep requ est bits is explained in figure 15. first a rslp command is uploaded to the sensor. as a result of that, the sensor will put the status fl ag bit 4 (sleep request flag) high. the master can read out that flag by uploading a nop command, or when uploading other commands. the master can confirm to go into sleep mode by upl oading a cslp command. the request flag will be res et and the sensor will switch into sleep state. the st atus flag bits 6 and 5 will be set accordingly. figure 15 : power state and sleep request bits
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 41 of 41 39010xxxxx to go into standby mode, the same procedure shall b e applied: uploading a rstby command makes the request standby flag going high. uploading a cstby will make the device going into standby mode, where by the request standby flag will be cleared and the po wer state bits will be set accordingly. bit 2: device in testmode/normal mode to make the sensor efficiently testable in producti on, several test modes are foreseen to get easy acc ess to different blocks. the status flag bit 2 indicates i f the device is operating in test mode or normal mo de. if the device enters test mode by accident, the app lication will still work like normal. however, the status flag bit 2 will be set high. the master can take ac tions to get out of test mode by uploading a cr com mand. bit 1: internal oscillator is enabled/disabled this bit is high when the internal oscillator is en abled. once the rco is shut down the bit will be se t low. bit 0: critical error is detected/not detected during each measurement cycle there is a monitoring of the voltage on critical nodes along the analog paths. when the voltage of one of these controlled nodes goes out of its normal operating range, the critical error flag will be set high. following nodes are monitored : - tia output: when the output is clipped (either hi gh or low), the critical error flag will be set hig h - difference between dac output and shunt-feedback - an internal reference voltage - output of the common mode sc-amplifiers of the am bient light/temperature channels - frequency on rco output - voltage on the vsup pin in case the critical error flag was set high, the ' err' register indicates which node voltages got out of their normal operating range. more info about the 'err' r egister can be found in section 8.13.6. the critical error flag remains high as long as the 'err' register is not cleared. once the 'err' regi ster is cleared, the critical error flag will be cleared as well. note : after por, or after wake-up from sleep/stand by, some bits in the 'err' register might be set. as such the critical error flag might be set as wel l.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 42 of 42 39010xxxxx 8 88 8.13 .13.13 .13. .. . user registers overview user registers overview user registers overview user registers overview in the next sections, all the bits of these registe rs are described. the value of the register at powe r-on is indicated in the line 'init' (0 or 1 or x=unknown) and the read/write access ability is indicated in t he line 'read/write' (r indicates read access, w indicates write access). name address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 setana 0x0 vsuplow1 vsuplow0 - - - tdc_pulse1 tdc_pulse0 unity_gain setah 0x1 daca7 daca6 daca5 daca4 daca3 daca2 daca1 daca0 setal 0x2 gain_adj _a2 gain_adj _a1 gain_adj _a0 - bw_adj _a1 bw_adj _a0 - - setbh 0x3 dacb7 dacb6 dacb5 dacb4 dacb3 dacb2 dacb1 dacb0 setbl 0x4 gain_adj _b2 gain_adj _b1 gain_adj _b0 - bw_adj _b1 bw_adj _b0 - - settp 0x5 - - en_ ledsens en_ vsupmon - tp2 tp1 tp0 err 0x6 err_ vsuph err_ tia err_ drv err_ vref err_ amb err_ rco - err_ vsupl rst 0x7 - - - - trimok diechip to por version 0x8 ver3 ver2 ver1 ver0 - - - - reserved 0x9 - - - - - - - - gainbuf 0xa - - - gain_buf4 gain_buf3 gain_buf2 gain_buf1 gain_buf0 calib1 0xb trim_ t_slope4 trim_ t_slope3 trim_ t_slope2 trim_ t_slope1 trim_ t_slope0 - - - calib2 0xc - - trim_ temp5 trim_ temp4 trim_ temp3 trim_ temp2 trim_ temp1 trim_ temp0 enchan 0xd en_temp en_diag_a en_diag_b en_ch_a en_ch_b en_ch_c en_ch_d - tamb 0xe - - - - - - tamb1 tamb0 setpls 0xf os_adj_ led1 os_adj_ led0 g_adj_ led1 g_adj_ led0 - - rise1 rise0
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 43 of 43 39010xxxxx 8 88 8.13. .13. .13. .13.0 00 0. .. . setana register setana register setana register setana register this register contains some settings of the analog chain. bit 7 6 5 4 3 2 1 0 setana vsup low1 vsup low0 - - - tdc_ pulse1 tdc_ pulse0 unity_ gain 0x0 read/write r/w r/w r r r r/w r/w r/w init 1 0 0 0 0 1 0 1 vsuplow<1:0>: defines the threshold voltage at whic h the critical error flag err_vsupl is set vsuplow1 vsuplow0 vsup threshold (v) 0 0 5 0 1 5.5 1 0 6 1 1 6.5 setana<5:3>: not implemented, read as '0' tdc_pulse<1:0>: defines the time that the dc compon ent in the active light pulse signal is enabled before the actual active light pu lses start. the time mentioned in the table below is the delay time as generated by the d igital logic. tdc_ pulse1 tdc_ pulse0 delay time (in s, +/-8%) 0 0 50 0 1 100 1 0 200 1 1 400 unity_gain: only during active light measurements: 1=adc buffer is bypassed, 0=adc gain stage is used (gain is set with bits gain_buf< 4:0> in register 'gainbuf')
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 44 of 44 39010xxxxx 8 88 8.13. .13. .13. .13.1 11 1. .. . setah register setah register setah register setah register this register defines the dac level for ir channel a. bit 7 6 5 4 3 2 1 0 setah daca7 daca6 daca5 daca4 daca3 daca2 daca1 daca0 0x1 read/write r/w r/w r/w r/w r/w r/w r/w r/w init 0 0 0 0 0 0 0 0 daca<7:0>: the 8 bits of the dac level for ir chann el a 8.13.2 8.13.2 8.13.2 8.13.2. .. . s ss setal register etal register etal register etal register this register defines the gain and cut-off frequenc y adjustments for ir channel a. bit 7 6 5 4 3 2 1 0 setal gain_ adj _a2 gain_ adj _a1 gain_ adj _a0 - bw_ adj _a1 bw_ adj _a0 - - 0x2 read/write r/w r/w r/w r r/w r/w r r init 0 0 0 0 0 1 0 0 gain_adj_a<2:0>: gain adjustment of channel a gain_adj_ _a2 gain_adj_ _a1 gain_adj_ _a0 gain 0 0 0 3 0 0 1 5.8 0 1 0 8.7 0 1 1 11.5 1 0 0 14.4 1 0 1 17.1 1 1 0 20.3 1 1 1 22.5 setal<4>: not implemented, read as '0' bw_adj_a<1:0>: cut-off frequency adjustment of chan nel a bw_adj_ _a1 bw_adj_ _a0 3db cut - off frequency (khz) 0 0 15 0 1 30 1 0 45 1 1 70 setal<1:0>: not implemented, read as '0'
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 45 of 45 39010xxxxx 8.13.3 8.13.3 8.13.3 8.13.3. .. . setbh register setbh register setbh register setbh register this register defines the dac level for ir channel b. bit 7 6 5 4 3 2 1 0 setbh dacb7 dacb6 dacb5 dacb4 dacb3 dacb2 dacb1 dacb0 0x3 read/write r/w r/w r/w r/w r/w r/w r/w r/w init 0 0 0 0 0 0 0 0 dacb<7:0>: the 8 bits of the dac level for ir chann el b 8.13.4 8.13.4 8.13.4 8.13.4. .. . s ss setbl register etbl register etbl register etbl register this register defines the gain and cut-off frequenc y adjustments for ir channel b. bit 7 6 5 4 3 2 1 0 setbl gain_ adj _b2 gain_ adj _b1 gain_ adj _b0 - bw_ adj _b1 bw_ adj _b0 - - 0x4 read/write r/w r/w r/w r r/w r/w r r init 0 0 0 0 0 1 0 0 gain_adj_b<2:0>: gain adjustment of channel b gain_adj_b2 gain_adj_b1 gain_adj_b0 gain 0 0 0 3 0 0 1 5.8 0 1 0 8.7 0 1 1 11.5 1 0 0 14.4 1 0 1 17.1 1 1 0 20.3 1 1 1 22.5 setbl<4>: not implemented, read as '0' bw_adj_b<1:0>: cut-off frequency adjustment of chan nel b bw_adj_b1 bw_adj_b0 3db cut-off frequency (khz) 0 0 15 0 1 30 1 0 45 1 1 70 setbl<1:0>: not implemented, read as '0'
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 46 of 46 39010xxxxx 8.13.5 8.13.5 8.13.5 8.13.5. .. . settp register settp register settp register settp register this register contains some enable signals and defi nes the pulse duration setting for the active light measurements. bit 7 6 5 4 3 2 1 0 settp - - en_leds ens en_vsup mon - tp2 tp1 tp0 0x5 read/write r r r/w r/w r r/w r/w r/w init 0 0 1 1 0 0 1 1 settp<7:6>: not implemented, read as '0' en_ledsens: 1 = enables led temperature sensing, 0 = disables led temperature sensing en_vsupmon: 1 = enables voltage monitoring on vsup, 0 = disables voltage monitoring on vsup tp<2:0>: pulse duration selection for the active li ght measurements, as defined below : bit 2 - tp2 bit 1 - tp1 bit 0 - tp0 pulse width (+/- 8%) 0 0 0 4 s 0 0 1 9.6 s 0 1 0 14.4 s 0 1 1 19.2 s 1 0 0 24s 1 0 1 29.6s 1 1 0 49.6s 1 1 1 79.2s note : the target pulse width's to be used are: 14. 4, 19.2, 24 and 29.6s. the smaller and the larger pulse width's are availa ble for engineering purposes only. for the smaller pulse width's the settling of the led driver is not guara nteed. for the larger pulse width's the thermal beh aviour is not guaranteed.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 47 of 47 39010xxxxx 8.13.6 8.13.6 8.13.6 8.13.6. .. . e ee err register rr register rr register rr register as described in section 0 (under section 'bit 0: cr itical error is detected/not detected'), the voltag es on critical nodes are monitored continuously. when a v oltage on such a critical node goes outside its ope rating range, the critical error flag and the appropriate error bit in the 'err' register will be set high. a s such, the source of the error can be found in the 'err' regis ter. the error bit remains high as long as the error con dition is present, or as long as the error bit is n ot cleared (in case the error condition is not present anymore ). bit 7 6 5 4 3 2 1 0 err err_ vsuph err_ tia err_ drv err_ vref err_ amb err_ rco - err_ vsupl 0x6 read/write r/w* r/w* r/w* r/w* r/w* r/w* r r/w* init x** 0 0 x** x** x** 0 x** the following bits are defined (0= no error detecte d; 1=error is detected) : err_vsuph: critcal error detected on battery supply voltage: vsup > 20v typical. as long as vsup > 20v typical, the led driver will be shut off to avoid damaging the led's. measurement data should be discarded in this situation. err_tia: critical error detected on tia output err_drv: critical error detected on the difference between dac output and shunt-feedback err_vref: critical error detected on internal volta ge reference: when the internal voltage reference is below 1v. err_amb: critical error detected on one of the comm on mode sc-filters of the ambient light/temperature channels err_rco: critical error detected on rco: either a s tuck-at-high or a stuck-at-low condition occurred at the output of the rco. note that in slp , the error flag on the rco will be set high. err<1>: not implemented, read as '0' err_vsupl: critical error detected on battery suppl y voltage: vsup < 6v typical (default). note that this threshold is programmable with 2 bit s vsuplow<1:0>). * : only writing '0' is allowed. if a '1' is writte n, the bit value in the register will not be change d, but bit 7 of the internal status flags will be set high (previou s command invalid). ** : 'x' indicates that the value after por is unkn own. if the voltages of the nodes are out of range right after por, it will be immediately reflected in the 'err' register and the critical error flag will be set. t he same is valid after wake-up from sleep/standby.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 48 of 48 39010xxxxx 8.13.7 8.13.7 8.13.7 8.13.7. .. . rst rstrst rst register register register register this register allows differentiation of either a po r or a reset due to a watchdog time-out + settings for the pd compensation circuitry. bit 7 6 5 4 3 2 1 0 rst - - - - trimok diechip to por 0x7 read/write r - r - r - r - r r r r/w init 0 0 0 0 1 0 0 1 trimok: 1 if device passed both 105degc and m40degc test successfully, 0 if one of the tests is not passed successfully diechip: 1 if die chipping is present, 0 is not die chipping is present. note that diechip will only be valid during nrm. to: 1=a watchdog time-out and a master reset occurr ed. 0=no watchdog time-out occurred, or after power-on, or after a wdt command por: 1=a por occurred, 0=a por has not occurred. to detect subsequent power-on-resets, the por-bit shall be cleared right after power-on. 8.13. 8.13. 8.13. 8.13.8 88 8. .. . version register version register version register version register this register contains the actual device version + settings for the pd compensation circuitry. bit 7 6 5 4 3 2 1 0 version ver3 ver2 ver1 ver0 - - - - 0x8 read/write r r r r r r r r init 0 0 0 1 0 0 0 0 ver<3:0>: indicates the device version (will be inc remented at every design iteration) o a-version: ver<3:0> = 4'b0001
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 49 of 49 39010xxxxx 8 88 8.10.9 .10.9 .10.9 .10.9. .. . reserved register reserved register reserved register reserved register this register is used for internal evaluation purpo ses. 8.10.10 8.10.10 8.10.10 8.10.10. .. . gainbuf register gainbuf register gainbuf register gainbuf register this register contains the gain settings of the adc input buffer. the use of this buffer is depending on bit 'unity_gain' in the register 'setana'. it is recomm ended to keep the gainbuf register to its default v alue. please contact melexis before changing it. bit 7 6 5 4 3 2 1 0 gainbuf - - - gain_ buf4 gain_ buf3 gain_ buf2 gain_ buf1 gain_ buf0 0xa read/write r r r r/w r/w r/w r/w r/w init 0 0 0 1 1 0 1 0 gainbuf<7:5>: not implemented, read as '0' gain_buf<4:0>: defines the gain setting of the adc input buffer gain_ buf4 gain_ buf3 gain_ buf2 gain_ buf1 gain_ buf0 gain 0 0 0 0 1 2 0 0 0 1 0 1 0 0 0 1 1 0.67 0 0 1 0 0 0.5 0 0 1 0 1 0.4 0 0 1 1 0 0.33 0 0 1 1 1 0.29 0 1 0 0 0 0.25 0 1 0 0 1 0.22 0 1 0 1 0 0.2 1 0 0 0 1 10 1 0 0 1 0 5 1 0 0 1 1 3.33 1 0 1 0 0 2.5 1 0 1 0 1 2 1 0 1 1 0 1.67 1 0 1 1 1 1.43 1 1 0 0 0 1.25 1 1 0 0 1 1.11 1 1 0 1 0 1
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 50 of 50 39010xxxxx 8.13.11 8.13.11 8.13.11 8.13.11/12 /12/12 /12 calib1/calib2 calib1/calib2 calib1/calib2 calib1/calib2 register register register register these registers contain the calibration settings fo r the temperature sensor. bit 7 6 5 4 3 2 1 0 calib1 trim_ t_slope4 trim_ t_slope3 trim_ t_slope2 trim_ t_slope1 trim_ t_slope0 - - - 0xb read/write r r r r r r r r init x x x x x 0 0 0 trim_t_slope<4:0>: defines the slope of the tempera ture sensor calib1<2:0>: not implemented, read as '0' the calib1 register is used to indicate the slope o f the temperature sensor curve in lsb/kelvin. the s lope is calculated out of a 2-point measurement of the temp erature curve and is permanently programmed in the otp by means of a 5 bit word and accessible via the calib1 register, see table 23. calib1 - trim_t_slope<4:0> dec bin slope (lsb/kelvin) dec bin slope (lsb/kelvin) 0 0 - 51 16 10000 - 67 1 1 - 52 17 10001 - 68 2 10 - 53 18 10010 - 69 3 11 - 54 19 10011 - 70 4 100 - 55 20 10100 - 71 5 101 - 56 21 10101 - 72 6 110 - 57 22 10110 - 73 7 111 - 58 23 10111 - 74 8 1000 - 59 24 11000 - 75 9 1001 - 60 25 11001 - 76 10 1010 - 61 26 11010 - 77 11 1011 - 62 27 11011 - 78 12 1100 - 63 28 11100 - 79 13 1101 - 64 29 11101 - 80 14 1110 - 65 30 11110 - 81 15 1111 - 66 31 11111 - 82 table 23 : 5-bit temperature sensor slope informati on as it is stored in the calib1 register. bit 7 6 5 4 3 2 1 0 calib2 - - trim_ temp5 trim_ temp4 trim_ temp3 trim_ temp2 trim_ temp1 trim_ temp0 0xc read/write r r r r r r r r init 0 0 x x x x x x calib2<7:6>: not implemented, read as '0' trim_temp<5:0>: defines the calibration settings of the temperature sensor
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 51 of 51 39010xxxxx the offset of the temperature curve is measured at one temperature (preferably 30degc) and permanently stored in the zenerzap otp with 6 bit word length. this information is accessible via the calib2 regis ter, see table 24. calib2 - trim_temp<5:0> slope: - 67lsb/k 25degc 30degc dec bin offset (degc) lsl expected usl lsl expected usl 1 1 - 31 10005.5 10039 10072.5 9670.5 9704 9737.5 2 10 - 30 10072.5 10106 10139.5 9737.5 9771 9804.5 3 11 - 29 10139.5 10173 10206.5 9804.5 9838 9871.5 4 100 - 28 10206.5 10240 10273.5 9871.5 9905 9938.5 5 101 - 27 10273.5 10307 10340.5 9938.5 9972 10005.5 6 110 - 26 10340.5 10374 10407.5 10005.5 10039 10072.5 7 111 - 25 10407.5 10441 10474.5 10072.5 10106 10139.5 8 1000 - 24 10474.5 10508 10541.5 10139.5 10173 10206.5 9 1001 - 23 10541.5 10575 10608.5 10206.5 10240 10273.5 10 1010 - 22 10608.5 10642 10675.5 10273.5 10307 10340.5 11 1011 - 21 10675.5 10709 10742.5 10340.5 10374 10407.5 12 1100 - 20 10742.5 10776 10809.5 10407.5 10441 10474.5 13 1101 - 19 10809.5 10843 10876.5 10474.5 10508 10541.5 14 1110 - 18 10876.5 10910 10943.5 10541.5 10575 10608.5 15 1111 - 17 10943.5 10977 11010.5 10608.5 10642 10675.5 16 10000 - 16 11010.5 11044 11077.5 10675.5 10709 10742.5 17 10001 - 15 11077.5 11111 11144.5 10742.5 10776 10809.5 18 10010 - 14 11144.5 11178 11211.5 10809.5 10843 10876.5 19 10011 - 13 11211.5 11245 11278.5 10876.5 10910 10943.5 20 10100 - 12 11278.5 11312 11345.5 10943.5 10977 11010.5 21 10101 - 11 11345.5 11379 11412.5 11010.5 11044 11077.5 22 10110 - 10 11412.5 11446 11479.5 11077.5 11111 11144.5 23 10111 - 9 11479.5 11513 11546.5 11144.5 11178 11211.5 24 11000 - 8 11546.5 11580 11613.5 11211.5 11245 11278.5 25 11001 - 7 11613.5 11647 11680.5 11278.5 11312 11345.5 26 11010 - 6 11680.5 11714 11747.5 11345.5 11379 11412.5 27 11011 - 5 11747.5 11781 11814.5 11412.5 11446 11479.5 28 11100 - 4 11814.5 11848 11881.5 11479.5 11513 11546.5 29 11101 - 3 11881.5 11915 11948.5 11546.5 11580 11613.5 30 11110 - 2 11948.5 11982 12015.5 11613.5 11647 11680.5 31 11111 - 1 12015.5 12049 12082.5 11680.5 11714 11747.5 32 100000 0 12082.5 12116 12149.5 11747.5 11781 11814.5 33 100001 1 12149.5 12183 12216.5 11814.5 11848 11881.5 34 100010 2 12216.5 12250 12283.5 11881.5 11915 11948.5 35 100011 3 12283.5 12317 12350.5 11948.5 11982 12015.5 36 100100 4 12350.5 12384 12417.5 12015.5 12049 12082.5 37 100101 5 12417.5 12451 12484.5 12082.5 12116 12149.5 38 100110 6 12484.5 12518 12551.5 12149.5 12183 12216.5 39 100111 7 12551.5 12585 12618.5 12216.5 12250 12283.5 40 101000 8 12618.5 12652 12685.5 12283.5 12317 12350.5 41 101001 9 12685.5 12719 12752.5 12350.5 12384 12417.5
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 52 of 52 39010xxxxx 42 101010 10 12752.5 12786 12819.5 12417.5 12451 12484.5 43 101011 11 12819.5 12853 12886.5 12484.5 12518 12551.5 44 101100 12 12886.5 12920 12953.5 12551.5 12585 12618.5 45 101101 13 12953.5 12987 13020.5 12618.5 12652 12685.5 46 101110 14 13020.5 13054 13087.5 12685.5 12719 12752.5 47 101111 15 13087.5 13121 13154.5 12752.5 12786 12819.5 48 110000 16 13154.5 13188 13221.5 12819.5 12853 12886.5 49 110001 17 13221.5 13255 13288.5 12886.5 12920 12953.5 50 110010 18 13288.5 13322 13355.5 12953.5 12987 13020.5 51 110011 19 13355.5 13389 13422.5 13020.5 13054 13087.5 52 110100 20 13422.5 13456 13489.5 13087.5 13121 13154.5 53 110101 21 13489.5 13523 13556.5 13154.5 13188 13221.5 54 110110 22 13556.5 13590 13623.5 13221.5 13255 13288.5 55 110111 23 13623.5 13657 13690.5 13288.5 13322 13355.5 56 111000 24 13690.5 13724 13757.5 13355.5 13389 13422.5 57 111001 25 13757.5 13791 13824.5 13422.5 13456 13489.5 58 111010 26 13824.5 13858 13891.5 13489.5 13523 13556.5 59 111011 27 13891.5 13925 13958.5 13556.5 13590 13623.5 60 111100 28 13958.5 13992 14025.5 13623.5 13657 13690.5 61 111101 29 14025.5 14059 14092.5 13690.5 13724 13757.5 62 111110 30 14092.5 14126 14159.5 13757.5 13791 13824.5 63 111111 31 14159.5 14193 14226.5 13824.5 13858 13891.5 calib2 - trim_temp slope: - 67lsb/k 85degc 105degc dec bin offset (degc) lsl expected usl lsl expected usl 1 1 - 31 5985.5 6019 6052.5 4645.5 4679 4712.5 2 10 - 30 6052.5 6086 6119.5 4712.5 4746 4779.5 3 11 - 29 6119.5 6153 6186.5 4779.5 4813 4846.5 4 100 - 28 6186.5 6220 6253.5 4846.5 4880 4913.5 5 101 - 27 6253.5 6287 6320.5 4913.5 4947 4980.5 6 110 - 26 6320.5 6354 6387.5 4980.5 5014 5047.5 7 111 - 25 6387.5 6421 6454.5 5047.5 5081 5114.5 8 1000 - 24 6454.5 6488 6521.5 5114.5 5148 5181.5 9 1001 - 23 6521.5 6555 6588.5 5181.5 5215 5248.5 10 1010 - 22 6588.5 6622 6655.5 5248.5 5282 5315.5 11 1011 - 21 6655.5 6689 6722.5 5315.5 5349 5382.5 12 1100 - 20 6722.5 6756 6789.5 5382.5 5416 5449.5 13 1101 - 19 6789.5 6823 6856.5 5449.5 5483 5516.5 14 1110 - 18 6856.5 6890 6923.5 5516.5 5550 5583.5 15 1111 - 17 6923.5 6957 6990.5 5583.5 5617 5650.5 16 10000 - 16 6990.5 7024 7057.5 5650.5 5684 5717.5 17 10001 - 15 7057.5 7091 7124.5 5717.5 5751 5784.5 18 10010 - 14 7124.5 7158 7191.5 5784.5 5818 5851.5 19 10011 - 13 7191.5 7225 7258.5 5851.5 5885 5918.5 20 10100 - 12 7258.5 7292 7325.5 5918.5 5952 5985.5 21 10101 - 11 7325.5 7359 7392.5 5985.5 6019 6052.5
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 53 of 53 39010xxxxx 22 10110 - 10 7392.5 7426 7459.5 6052.5 6086 6119.5 23 10111 - 9 7459.5 7493 7526.5 6119.5 6153 6186.5 24 11000 - 8 7526.5 7560 7593.5 6186.5 6220 6253.5 25 11001 - 7 7593.5 7627 7660.5 6253.5 6287 6320.5 26 11010 - 6 7660.5 7694 7727.5 6320.5 6354 6387.5 27 11011 - 5 7727.5 7761 7794.5 6387.5 6421 6454.5 28 11100 - 4 7794.5 7828 7861.5 6454.5 6488 6521.5 29 11101 - 3 7861.5 7895 7928.5 6521.5 6555 6588.5 30 11110 - 2 7928.5 7962 7995.5 6588.5 6622 6655.5 31 11111 - 1 7995.5 8029 8062.5 6655.5 6689 6722.5 32 100000 0 8062.5 8096 8129.5 6722.5 6756 6789.5 33 100001 1 8129.5 8163 8196.5 6789.5 6823 6856.5 34 100010 2 8196.5 8230 8263.5 6856.5 6890 6923.5 35 100011 3 8263.5 8297 8330.5 6923.5 6957 6990.5 36 100100 4 8330.5 8364 8397.5 6990.5 7024 7057.5 37 100101 5 8397.5 8431 8464.5 7057.5 7091 7124.5 38 100110 6 8464.5 8498 8531.5 7124.5 7158 7191.5 39 100111 7 8531.5 8565 8598.5 7191.5 7225 7258.5 40 101000 8 8598.5 8632 8665.5 7258.5 7292 7325.5 41 101001 9 8665.5 8699 8732.5 7325.5 7359 7392.5 42 101010 10 8732.5 8766 8799.5 7392.5 7426 7459.5 43 101011 11 8799.5 8833 8866.5 7459.5 7493 7526.5 44 101100 12 8866.5 8900 8933.5 7526.5 7560 7593.5 45 101101 13 8933.5 8967 9000.5 7593.5 7627 7660.5 46 101110 14 9000.5 9034 9067.5 7660.5 7694 7727.5 47 101111 15 9067.5 9101 9134.5 7727.5 7761 7794.5 48 110000 16 9134.5 9168 9201.5 7794.5 7828 7861.5 49 110001 17 9201.5 9235 9268.5 7861.5 7895 7928.5 50 110010 18 9268.5 9302 9335.5 7928.5 7962 7995.5 51 110011 19 9335.5 9369 9402.5 7995.5 8029 8062.5 52 110100 20 9402.5 9436 9469.5 8062.5 8096 8129.5 53 110101 21 9469.5 9503 9536.5 8129.5 8163 8196.5 54 110110 22 9536.5 9570 9603.5 8196.5 8230 8263.5 55 110111 23 9603.5 9637 9670.5 8263.5 8297 8330.5 56 111000 24 9670.5 9704 9737.5 8330.5 8364 8397.5 57 111001 25 9737.5 9771 9804.5 8397.5 8431 8464.5 58 111010 26 9804.5 9838 9871.5 8464.5 8498 8531.5 59 111011 27 9871.5 9905 9938.5 8531.5 8565 8598.5 60 111100 28 9938.5 9972 10005.5 8598.5 8632 8665.5 61 111101 29 10005.5 10039 10072.5 8665.5 8699 8732.5 62 111110 30 10072.5 10106 10139.5 8732.5 8766 8799.5 63 111111 31 10139.5 10173 10206.5 8799.5 8833 8866.5 table 24 : 6-bit temperature curve offset informati on for a typical slope of 67lsb/k.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 54 of 54 39010xxxxx 8.13.13 8.13.13 8.13.13 8.13.13. .. . enchan enchan enchan enchan register register register register this register contains bit to enable/disable active light and ambient light channels. bit 7 6 5 4 3 2 1 0 enchan en_ temp en_ diag_a en_ diag_b en_ ch_a en_ ch_b en_ ch_c en_ ch_d - 0xd read/write r/w r/w r/w r/w r/w r/w r/w r init 1 1 1 1 1 1 1 1 en_temp: 1 = temperature channel is in use, 0 = tem perature channel is not in use en_diag_a: 1 = enables diagnostics on active light channel a, 0 = disables the diagnostics en_diag_b: 1 = enables diagnostics on active light channel b, 0 = disables the diagnostics en_ch_a: 1 = active light channel a is enabled (tia + filter), 0 = active light channel a is completely switched off to reduce current consumpti on en_ch_b: 1 = active light channel b is enabled (tia + filter), 0 = active light channel b is completely switched off to reduce current consumpti on en_ch_c: 1 = ambient light channel c is in use, 0 = ambient light channel c is not in use en_ch_d: 1 = ambient light channel d is in use, 0 = ambient light channel d is not in use the bits en_ch_a/en_ch_b can be used to switch off channels that are not needed, and thus reducing the current consumption. when going into sleep or stand by the setting of these bits is ignored, all channe ls will be switched off independently of en_ch_a/en_ch_b. the bits en_temp/en_ch_c/en_ch_d/en_ch_e are used t o indicate which channels are in use and which channels are not in use. in case all en_ch_c/d/e bits are set to zero, but a n ambient measurement is requested, then the comman d invalid status flag will be set high. the measureme nt itself will not be executed.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 55 of 55 39010xxxxx 8 88 8.13.14 .13.14 .13.14 .13.14. .. . tamb tamb tamb tamb register register register register this register contains settings for the pd compensa tion circuitry + controls the repetition rate of th e auto- zero timer. bit 7 6 5 4 3 2 1 0 tamb - - - - - - tamb1 tamb0 0xe read/write r r r r r r r/w r/w init 0 0 0 0 0 0 1 0 tamb<3:2>: not implemented, read as '0' tamb<1:0>: controls the repetition rate of the auto -zero timer tamb1 tamb0 repetition rate (ms +/-8%) 0 0 1.25 0 1 2.5 1 0 5 1 1 10 8.13.15 8.13.15 8.13.15 8.13.15. .. . setpls register setpls register setpls register setpls register this register provides parameters to set up the led temperature sensing circuit and it defines the sha pe of the active light pulses. bit 7 6 5 4 3 2 1 0 setpls os_ adj_ led1 os_ adj_ led0 g_ adj_ led1 g_ adj_ led0 - - rise1 rise0 0xf read/write r/w r/w r/w r/w r r r/w r/w init 0 1 0 0 0 0 1 0 os_adj_led<1:0>: input offset selection for led tem perature sensing circuit os_adj_led1 os_adj_led0 reference input 0 0 0.03 v 0 1 0.85 v 1 0 1.65 v 1 1 2.47 v g_adj_led<1:0>: amplifier gain selection for led te mperature sensing circuit
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 56 of 56 39010xxxxx g_adj_led1 g_adj_led0 gain 0 0 0.99 0 1 1.98 1 0 2.98 1 1 3.99 setpls<3:2>: not implemented, read as '0' rise<1:0>: controls the shape of the active light p ulses rise1 rise0 rise time of active light pulses (1tau - s) 0 0 7 0 1 5 1 0 3 1 1 1 8 88 8.14 .14.14 .14. .. . window watchdog timer window watchdog timer window watchdog timer window watchdog timer the internal watchdog timer is a watchdog based on two different windows: an open and a closed window. during the open window the master can restart the w atchdog timer. during the closed window, no restart s are accepted. the restart (re-initialisation) of the watchdog tim er happens via watchdog trigger command: when a wdt command is sent, the watchdog will be restarted. after a por or a reset issued by the watchdog and a fter a wake-up from sleep mode (by uploading the nr m command), the window watchdog will open an active w indow of a time twdt_init, during which a watchdog restart must be issued by the c. if no watchdog re start is received by the end of the open window, th e c will be reset. after this initial period, the window watchdog is p rogrammed to wait a time twdt_closed during which n o watchdog restarts are allowed. if a watchdog restar t is sent during the closed window time, the watchd og will reset the master via the mr (master reset) pin . after a closed window, an open window of a time twd t_open will follow during which a watchdog restart is expected. if no watchdog restart is received till t he end of the open window, the c will be reset via the mr pin. changing mode between normal running mode and stand by mode will not influence the watchdog timing or state. also a cr command will not change the use d window times. the watchdog counter will not be influenced when changing mode between nrm and stby or when uploading a cr command. the watch dog timer is disabled in sleep mode. send ing a wdt command in the sleep mode will set the previous command invalid flag high. coming back fro m sleep mode to normal running mode always restarts the watchdog with the initial timing windo w. this figure shows what timing windows are used in t he different operating modes :
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 57 of 57 39010xxxxx figure 16 : window times during different operating modes the two figures below show the functionality of the watchdog timer : figure 17 : functionality of the window watchdog ti mer a reset of the c due to time-out of the watchdog i s achieved by setting the mr pin low during a time t mr (default state of the mr pin is high).
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 58 of 58 39010xxxxx 8 88 8.15 .15.15 .15. .. . reset behaviour reset behaviour reset behaviour reset behaviour power-on reset after a power-on reset, the device is operating in normal running mode. all internal data registers are set to their initia l state : ? the device state is normal running mode ? the watchdog counter is initialized to generate the initial window time ? all registers containing (diagnostic) measurement d ata are initialized to 0x00 ? bits 7, 4, 3 of the internal status flags are clear ed ? the user settings registers are set to their initia l values (see section 0) ? the 'err' register will initialize to 0x00. however , as some voltages are continuously measured, it wi ll reflect immediately if an error is detected or not. the mr pin will be initialized to '1'. the dr pin will be initialized to '0', but after the time t startup it will switch to '1' to indicate that the device is ready to acce pt the first command (see also section 0). the output of the miso pin is depending on the cs state: if cs is high, the miso pin is in tri-state. if cs is low, the output of the miso pin is undefined, but either logic high or logic l ow. cr command at every upload of the cr command, the device retur ns to the state like it is after a power-on-reset, except for the watchdog counter and the state of the mr line. the watchdog counter and the state of the mr line will not be influenced by uploading a cr command. a lso, the cr command will not change the contents of bits 1 and 0 of the register 'rst'. after a cr command the dr pin will be kept low duri ng a time t startup . read-out at the end of each read-out, all registers containi ng (diagnostic) measurement data are cleared to 0x0 0. watchdog time-out when a reset occurs due to a watchdog time-out, the mr pin will go low for a time t mr . the watchdog counter will be initialized with the window time t wdt_init . all other states, lines and registers of the asic will not be affected. changing operation mode when changing operation mode (rslp, cslp, rstby, cs tby, nrm) the right status flags are set. changing operation mode will not affect the user se ttings registers and the (diagnostic) measurement d ata registers. the dr pin will be set to '0' and after the time t wakeup_slp resp. t wakeup_stby it will be set to '1', when waking up from sleep resp. standby mode.
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 59 of 59 39010xxxxx 8.16 8.16 8.16 8.16. .. . supply voltage behaviour supply voltage behaviour supply voltage behaviour supply voltage behaviour the next figure gives an overview of the behaviour of the por, the mr/watchdog and the under/overvoltage error flags for changing power su pply voltage. figure 18 : supply voltage behaviour
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 60 of 60 39010xxxxx 8.17 8.17 8.17 8.17. .. . wake wake wake wake- -- -up from sleep or standby up from sleep or standby up from sleep or standby up from sleep or standby the figure below shows what happens when switching operation mode, and the behaviour of the dr pin, the sleepb pin and the watchdog timer. when a nrm command is uploaded during sleep or stan dby, the following will happen: - the dr pin goes low for a time t wakeup_stby or t wakeup_slp - the watchdog timer is initialised and starts coun ting, when waking up from sleep - the device changes to normal running mode, enabli ng the appropriate blocks - the sleepb pin goes high figure 19 : behaviour of dr and watchdog when switc hing mode
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 61 of 61 39010xxxxx 8.18 8.18 8.18 8.18. .. . crc calculation crc calculation crc calculation crc calculation the 8-bit crc calculation will be based on the poly nomial x 8 + x 2 + x 1 + x 0 . this polynomial is widely used in the industry, it is e.g. used for generating: ? the header error correction field in atm (asynchron ous transfer mode) cells ? the packet error code in smbus data packets some probabilities of detecting errors when using t his polynomial: ? 100% detection of one bit errors ? 100% detection of double bit errors (adjacent bits) ? 100% detection of two single-bit errors for frames less than 128 bits in length ? 100% detection of any odd number of bits in error ? 100% detection of burst errors up to 8 bits ? 99.61% detection of any random error a possible hardware implementation using a linear f eedback shift register (lfsr) is shown in the figur e below: figure 20 : 8-bit crc implementation using a lfsr the generation of the crc requires the following st eps: reset all flip-flops 0x00 is the initial value, shifting in all zeroes d oes not affect the crc shift in the read-out data bytes. first byte is dat a byte 1 (= internal status flags), last byte is data byte (x+1) (with x defined in fig ure 12). when the last byte has been shifted in, the flip-fl ops contain the crc: crc=ff[8..1]. an easy method to check if there were no transmissi on errors is to calculate the crc of the whole read -out data stream including the crc byte. when the calcul ated crc results in 0x00, the transmission was most likely error free. if the resulting crc is not equa l to zero, then an error occurred in the transmissi on and the complete data stream should be ignored. some crc results for example messages are given in table 25. ascii string messages crc result - none - 0x00 "a" 0xc0 "123456789" 0xf4 a string of 256 upper case "a" characters with no line breaks 0x8e table 25 : crc examples
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 62 of 62 39010xxxxx 8.19 8.19 8.19 8.19. .. . global timing diagrams global timing diagrams global timing diagrams global timing diagrams a global timing diagram with separate sm-ro cycles is given in figure 21. after power-up there is a po wer- on-reset phase (por) to initialize the sensor into a reset state. when the device is ready to accept t he first command, the dr pin goes high. in figure 21 the first command is t he wr command to define the contents of the user registers (optionally). the first measu rement cycle is e.g. initiated by uploading a sm co mmand. after completion of the measurement cycle, the dr goes high. this indicates that the read-out cycle can be started. a ro command has to be uploaded to bring t he data on the miso pin. when the read-out is completed, a new measurement cycle can be started. in figure 21 a sm command is used. this starts a ne xt measurement cycle. once dr is high, a read-out can be done again. in between different measurement/read-out cycles, t he user registers can be changed with wr commands. optionally those registers can be read ba ck with the rr command to check if the right values were uploaded. cs sclk mosi miso idle sm measurement device state dr idle read-out idle 0 data available filling up internal registers emptying ro por (wr) sm output data sm measurement idle read-out idle data available filling up 0 ro (wr) sm output data emptying 0 por figure 21 : global timing diagram with separate sm -ro figure 22 shows a timing diagram wherein separate s m-ro cycles are mixed with combined sm-ro cycles. after the power-on-reset phase, a sm measurement cy cle is started. once the dr pin is high, the data can be read out. a sm command with extra clocks is used to combine the read-out and the start of the next measurement cycle. with the extra clocks, the data of the internal registers is transferred to the miso pin. when the cs pin goes high, the next measurement cycle (sm) wil l be started. once the dr pin is high, a normal ro command is uploaded to br ing the data to the miso pin. if needed, the settings in the user registers can be changed with the wr command and optionally the rr command can be used to check if the right values were uploaded. a new measurement cycle can be started with e.g. a normal sm command. when the dr pin is high, the data can be transferred by uploading e.g. a sm comm and that combines the read-out and the start of a n ew measurement cycle. figure 22: global timing diagram with separate sm-r o and combined sm-ro together
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 63 of 63 39010xxxxx 9. application information 9.1 9.19.1 9.1. .. . application circuit application circuit application circuit application circuit the exact drive circuit for the leds, the shunt res istor, photodiodes and power supply filter componen ts can change for each application. the table below summar izes a possible set of external components. a typical application diagram is shown in figure 23 . note that the capacitor on cext has a defined ran ge of 10..100nf, however 68nf is highly recommended to gi ve the best results. ambient d etector active light d etector led sfh2270 bpw34fa sfh4232 sfh3410 vbpw34fa sfh4250 sfh3710 vbp104fas sfh4253 sfh5711 sfh2400fa sfh4257 sfh2430 sfh2701 vsmy1850x01 bp104s vsmy3850 temd6010fx01 vsmb3940 temd6200fx02 temt6000x01 temt6200fx01 table 26 : external components figure 23 : typical application circuit mlx75031
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 64 of 64 39010xxxxx 10. standard information regarding manufacturability of melexis products with differen t soldering processes our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test metho ds: reflow soldering smds (surface mount devices) ? ipc/jedec j-std-020 moisture/reflow sensitivity classification for nonh ermetic solid state surface mount devices (classification reflow profiles according to table 5-2) ? eia/jedec jesd22-a113 preconditioning of nonhermetic surface mount device s prior to reliability testing (reflow profiles according to table 2) wave soldering smds (surface mount devices) and th ds (through hole devices) ? en60749-20 resistance of plastic- encapsulated smds to combin ed effect of moisture and soldering heat ? eia/jedec jesd22-b106 and en60749-15 resistance to soldering temperature for through-hol e mounted devices iron soldering thds (through hole devices) ? en60749-15 resistance to soldering temperature for through-hol e mounted devices solderability smds (surface mount devices) and thd s (through hole devices) ? eia/jedec jesd22-b102 and en60749-21 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature prof ile etc) additional classification and qualificatio n tests have to be agreed upon with melexis. the application of wave soldering for smds is allo wed only after consulting melexis regarding assuran ce of adhesive strength between device and board. melexis is contributing to global environmental con servation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on t he restriction of the use of certain hazardous substances) please vis it the quality page on our website: https://www.melexis.com/en/quality-environment
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 65 of 65 39010xxxxx 11. general recommendations - esd/emc precautions the application circuit board should be designed to minimize electro-magnetic compatibility problems. the chip is an esd sensitive device and should be h andled according to guideline en 61340-5-1 (protection of electronic devices from electrostatic phenomena ).
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 66 of 66 39010xxxxx 12. package information 12.1 12.1 12.1 12.1. .. . qfn 4x4 (24 pins): quad flat no qfn 4x4 (24 pins): quad flat no qfn 4x4 (24 pins): quad flat no qfn 4x4 (24 pins): quad flat no- -- -lead with exposed pad lead with exposed pad lead with exposed pad lead with exposed pad d x e n e a a1 a3 d2 e2 l k b quad all dimensions in mm 4 x 4 24 0.50 0.05 min 0.80 0.00 0.20 ref 2.50 2.50 0.35 0.20 0.18 max 1.00 0.05 2.70 2.70 0.45 C 0.30 table 27 : package drawing dimensions package jc [c/w] ja [c/w] (jedec 1s0p board) ja [c/w] (jedec 1s2p board) qfn 4x4 16 154 50 table 28 : ? ja values
mlx75031 optical gesture & proximity sensing ic with integrated led drivers datasheet revision 001 C january, 2013 page 67 of 67 39010xxxxx 13. disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, s tatutory, implied, or by description regarding the information set forth herein or regarding the freed om of the described devices from patent infringemen t. melexis reserves the right to change specifications and prices at any time and without notice. therefo re, prior to designing this product into a system, it i s necessary to check with melexis for current infor mation. this product is intended for use in normal commerci al applications. applications requiring extended temperature range, unusual environmental requiremen ts, or high reliability applications, such as milit ary, medical life-support or life-sustaining equipment a re specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall no t be liable to recipient or any third party for any dama ges, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequ ential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the t echnical data herein. no obligation or liability to recipien t or any third party shall arise or flow out of mel exis rendering of technical or other services. ? 2005 melexis nv. all rights reserved. for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direc t: europe, africa, asia: america: phone: +32 1367 0495 phone: +1 603 223 2362 e-mail: sales_europe@melexis.com e-mail: sales_usa@melexis.com iso/ts 16949 and iso14001 certified

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